Back to results
US 7,804,164 B2Granted
Subminiature electronic device having hermetic cavity and method of manufacturing the same
AssigneeBesdon Technology Corporation
InventorChon-Ming Tsai
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeBesdon Technology Corporation
InventorChon-Ming Tsai
Estimating the term…
The invention discloses a subminiature electronic device with a hermetic cavity and method of manufacturing the same. It particularly relates to a chip type or chip scale packaged electronic device produced in substrate level. Firstly, a sacrificial layer is coated onto each of the identical microstructures disposed on a large substrate. A protective layer containing glass powders is then applied to encapsulate the sacrificial layer. Afterwards, the sacrificial layer is removed so as to form a cavity between the microstructure and the protective layer. The whole protective layer is then melted at elevated temperature to seal the cavity in an environment of specific gas. Finally, the large substrate is diced into a plurality of individual devices with a hermetic cavity over the microstructure. The applicable fields include micro-electronic circuits, micro-vibration systems, micro electrical-mechanical systems (MEMS), and gas discharge apparatuses.
A subminiature electronic device with a sealed cavity, comprising:
A package of subminiature electronic device, comprising:
A subminiature electronic device with a sealed cavity, comprising:
A subminiature electronic device with a sealed cavity, comprising:
Dependencies are inferred from the claim text.