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US 7,804,161 B2Granted
Semiconductor device and dam for resin
AssigneeOki Semiconductor Co., Ltd.
InventorYoshihiro Saeki
Life of this patent
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Abstract
The invention provides a semiconductor device including a rectangular chip provided on a mounting region of a substrate, a liquid resin layer provided under the rectangular chip and on a side surface of the chip, and a plurality of dams formed on the substrate so as to extend along the side surface of the rectangular chip. The configuration allows the semiconductor device to be provided with the substrate having a reduced size which is achieved by preventing a liquid resin from flowing out.
Claims10
A semiconductor device, comprising:
- a substantially rectangular chip provided on a mounting region of a substrate;
- a liquid resin layer provided under the rectangular chip and at a side surface of the chip;
- and
- a plurality of nested dams formed on the substrate at a common side of the side surface, each of the plurality of dams having a length that is greatest in a direction parallel to the side surface, and each of the plurality of dams having a bending or curving shape that defines a recess that faces the side surface, such that opposing ends of each respective dam are closer together than an overall length of the respective dam, the plurality of dams being nested together, so that each dam is either disposed within the recess of an adjacent dam, or has an adjacent dam received within its recess.
1 more element
Dependencies are inferred from the claim text.