Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

A semiconductor device comprising:

• a tab having a first upper surface and a first lower surface opposing to the first upper surface;
• a plurality of leads having a second upper surface arranged in the same direction as the first upper surface of the tab, and a second lower surface opposing to the second upper surface, and arranged around the tab;
• a plurality of suspension leads supporting the tab, and having a third upper surface arranged in the same direction as the first upper surface of the tab, and a third lower surface opposing to the third upper surface;
• a semiconductor chip having a front surface, a plurality of connection pads formed on the front surface, and a back surface opposing to the front surface, and mounted on the first upper surface of the tab via an adhesive layer such that a central part of the semiconductor chip overlaps with the tab in a plan view;
• a plurality of wires only coupling the connection pads of semiconductor chip with the electrical leads;
• and
• a seal portion sealing the tab, the semiconductor chip, the wires, the suspension leads and the leads such that the second lower surface of each of the leads and the third lower surface of a part of each of the suspension leads are exposed from the seal portion;
• wherein the suspension leads are not bent in a thickness direction of the suspension leads, respectively;
• wherein the seal portion has a front surface arranged in the same direction as the first upper surface of the tab, a rear surface opposing to the front surface of the seal portion, and side surfaces locating between the front surface of the seal portion and the rear surface of the seal portion;
• wherein a thickness of each of the tab and other part of each of the suspension leads is thinner than that of each of the leads;
• wherein an entire first lower surface of the tab and the third lower surface of the other part of each of the suspension leads are covered with the sealing portion;
• wherein a thickness of the seal portion between the first lower surface of the tab and the rear surface of the seal portion is thinner than that of the sealing portion between the front surface of the semiconductor chip and the front surface of the seal portion;
• wherein the seal portion is formed such that the second lower surface of each of the leads and the third lower surface of the part of each of the suspension leads are exposed from the rear surface of the seal portion;
• and
• wherein the seal portion is formed such that the second lower surface of each of the leads and the third lower surface of the part of each of the suspension leads are located in the substantially same plane as the rear surface of the seal portion.