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US 7,804,131 B2Granted
Multi-chip module
AssigneeInternational Rectifier Corporation
InventorsChuan Cheah, Kunzhong Hu
Life of this patent
Estimating the term…
Abstract
A multi-chip module that includes a conductive element connecting at least two semiconductor devices, the conductive element including enhancements for improving the mechanical coupling between the conductive element and the molded housing of the MCM.
Claims20
A multi-chip module comprising:
- a first conductive pad, a second conductive pad and a third conductive pad having an opening therein;
- a conductive element, said conductive element including a web portion and a connector extending from a first major surface of said web portion and including a connection surface electrically and mechanically connected to said third conductive pad, said connector including a projection extending away from said connection surface of said connector and received in said opening;
- and
- a first semiconductor die and a second semiconductor die, each semiconductor die having a first contact of a first designation disposed on a first major surface thereof and a second contact of a second designation disposed on a second opposing major surface thereof;
- wherein said first contact of said first semiconductor die is electrically connected to said first conductive pad, said second contact of said second semiconductor die is connected to said second conductive pad, and said second contact of said first semiconductor die and said first contact of said second semiconductor die are connected to said first major surface of said web portion.
2 more elements
A multi-chip module comprising:
- a plurality of conductive pads;
- a plurality of semiconductor dies each electrically connected to at least one of the plurality of conductive pads;
- and
- a conductive element, said conductive element including a web portion and a connector extending from a first major surface of said web portion and including a connection surface electrically and mechanically connected to one of said plurality of conductive pads having openings, said connector including a plurality of projections disposed at opposing edges of said connector and extending away from said connection surface of said connector and into said openings;
- wherein said plurality of semiconductor dies are connected to said first major surface of said web portion.
2 more elements
A multi-chip module comprising:
- a plurality of conductive pads;
- a plurality or semiconductor dies each electrically connected to at least one of the plurality of conductive pads;
- a conductive element, said conductive element including a web portion and a connector extending from a first major surface of said web portion and including connection surface electrically and mechanically connected to one of said plurality of conductive pads having openings, said connector including a plurality of projections disposed at opposing edges of said connector and extending away from said connection surface of said connector and into said openings;
- wherein said plurality of semiconductor dies are connected to said first major surface of said web portion;
- and
- a molded housing enclosing said conductive element and said plurality of semiconductor dies.
3 more elements
Dependencies are inferred from the claim text.