US 7,804,030 B2Granted

Printed circuit board

AssigneeConti Temic Microelectronics GmbH

InventorsFerdinand Friedrich, Hubert Trageser, Bernhard Schuch, Friedrich Nehmeier

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Abstract

A circuit board (1) has a top face (2) for positioning an electronic component and a bottom face (4) used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) provide heat transfer from the top face (2) to the bottom face (4). The heat transfer holes (12) are unevenly or non-uniformly distributed on the top face (2) in such a way that the top face (2) is provided with several free sectors (14) which are free of heat transfer holes (12) in order to connect the electronic component to the circuit board (1). The free sectors (14) are configured as columns or lines. A plurality of heat transfer holes (12) are placed at least along the long sides of the free sectors (14). The circuit board has a low thermal resistance between the electronic component and the heat-dissipating base.

Claims29

Dependent claims

A printed circuit board (1)

with a top face (2) for positioning an electronic component (3),
with a bottom face (4) to support on a heat-dissipating base (5),
with a plurality of heat transfer holes (12), which create a heat transfer from the top face (2) to the bottom face (4),
wherein the heat transfer holes (12) are non-uniformly distributed on the top face (2) in such way that the top face (2) has several free sectors (14), which are free from heat transfer holes (12) in order to connect the electronic component (3) to the printed circuit board (1),
characterized in that the free sectors (14) are each configured as a respective elongated free area having an elongated strip shape with two opposite longer sides extending parallel to an elongation direction and two opposite shorter sides extending transversely to the elongation direction, wherein the longer sides are longer than the shorter sides, and wherein a respective plurality of the heat transfer holes are positioned adjacent to each one of the longer sides and are spaced apart from one another in a respective row extending parallel to the elongation direction along each one of the longer sides of the elongated free areas, and wherein an in-row spacing distance between adjacent ones of the heat transfer holes in one of the rows is less than a transverse spacing distance between two of the rows that are respectively adjacent to the two opposite longer sides of one of the elongated free areas.

2 more elements

A circuit board including a pad area for mounting an electronic device on said pad area, wherein said pad area of said circuit board has heat transfer holes passing therethrough and forming respective heat transfer paths therethrough from a top surface to a bottom surface thereof, wherein:

said holes are arranged as rows of said holes that extend parallel to one another along a longitudinal direction and that are distributed to form on said top surface plural holed strips each having one or more of said rows of said holes and plural hole-free strips free of said holes;
said hole-free strips are elongated in said longitudinal direction and are located between respective adjacent ones of said holed strips;
said holed strips each respectively include at least one of said rows that includes a plurality of said holes adjacent to and distributed in said longitudinal direction along a length of an adjacent one of said hole-free strips;
said holes in a respective one of said rows are spaced apart from one another at an in-row spacing distance along said longitudinal direction;
two of said rows of said holes that are respectively positioned adjacent to and along opposite sides of one of said hole-free strips are spaced apart from one another at a transverse spacing distance transversely to said longitudinal direction;
and
said transverse spacing distance is greater than said in-row spacing distance.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/918,585Filed 12 May 2006
Priority: DE 10 2005 022 06212 May 2005
Published: US 2009/0056980 A15 Mar 2009
Granted: 28 Sep 2010
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H05K 1/0206
Using means for thermal conduction connection in the thickness direction of the substrate: by printed thermal vias
H05K 3/341
By soldering: surface mounted components
H05K 3/3452
By soldering: solder masks
H05K 2201/099
Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809: coating over pads, e.g. solder resist partly over pads