Capacitive substrate and method of making same
AssigneeEndicott Interconnect Technologies, Inc.
InventorsRabindra N. Das, Frank D. Egitto, John M. Lauffer, How T. Lin, Voya R. Markovich
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Abstract
A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.
Claims10
A method of making a capacitive substrate, said method comprising:
- providing a first glass layer having a first surface and a second surface;
- providing a first conductor on said first surface of said first glass layer;
- positioning a capacitive dielectric layer on said first surface of said first glass layer and substantially over said first conductor using an ink jet printing process and substantially drying said capacitive dielectric layer at a predetermined temperature range;
- providing a second conductor on said first capacitive dielectric layer;
- positioning a second glass layer on said first capacitive dielectric layer and substantially over said second conductor, said second glass layer having a first surface;
- forming a first thru-hole electrical connection to said first conductor;
- and
- forming a second thru-hole electrical connection to said second conductor, said first and second conductors and said capacitive dielectric layer forming a capacitor when said capacitive substrate is in operation.
A method of making a capacitive substrate, said method comprising:
- providing a first glass layer having a first surface and a second surface;
- providing a first conductor on said first surface of said first glass layer;
- positioning a capacitive dielectric layer on said first surface of said first glass layer and substantially over said first conductor;
- providing a second conductor on said first capacitive dielectric layer;
- positioning a second glass layer on said first capacitive dielectric layer and substantially over said second conductor, said second glass layer having a first surface;
- forming a first thru-hole electrical connection to said first conductor;
- forming a second thru-hole electrical connection to said second conductor, said first and second conductors and said capacitive dielectric layer forming a capacitor when said capacitive substrate is in operation;
- and
- heat treating, including laser annealing, said capacitive dielectric layer on said first surface of said first glass layer and substantially over said first conductor at a first a pre-established temperature.
Dependencies are inferred from the claim text.