Apparatus and methods for cooling semiconductor integrated circuit package structures

A method for packaging an IC (integrated circuit) chip, comprising the steps of:

• forming a heat conducting device having a raised structure comprising a thermal contact surface and an outer projecting portion having a height greater than that of the raised structure;
• forming one or more channels in the thermal contact surface of the heat conducting device;
• forming a thermal interface between the thermal contact surface of the heat conducting device and a non-active surface of an IC chip, the thermal interface comprising a layer of compliant thermally conductive material;
• preventing compliant thermally conductive material from filling the one or more channels when forming the thermal interface, wherein preventing compliant thermally conductive material from filling the one or more channels when forming the thermal interface comprises:
• contacting the thermal contact surface to the chip surface with compliant thermally conductive material therebetween;
• and
• obstructing the one or more channels formed in the thermal contact surface to prevent complaint thermally conductive material from filling the one or more channels when contacting the thermal contact surface to the chip surface, wherein obstructing the one or more channels comprises:
• placing an object in each of the one or more channels;
• and
• removing the objects from the one or more channels after contacting the thermal contact surface to the chip surface;
• the method further comprising forming one or more openings through the heat conducting device, and wherein removing the objects from the one or more channels comprises removing the objects through the one or more openings;
• wherein forming a thermal interface between the thermal contact surface of the heat conducting device and a surface of an IC chip, comprises bonding the heat conducting device to a carrier substrate on which the IC chip is mounted such that the thermal contact surface and the surface of the IC chip are spaced apart at a fixed distance and in thermal contact through the compliant thermally conductive material;
• further wherein forming a thermal interface between the thermal contact surface of the heat conducting device and a surface of an IC chip, comprises dispensing an excess amount of the thermally conductive compliant material onto the thermal contact surface, or onto the non-active surface of the chip mounted to the carrier substrate, and wherein bonding the heat conducting device to the carrier substrate comprises:
• applying a bead of an adhesive sealant onto an bonding surface of the heat conducting device or a corresponding bonding surface of the package substrate;
• and
• contacting heat conducting device to the package substrate with a compression force to squeeze the bead of adhesive sealant and the excess thermally conductive compliant material to a desired adhesive sealant layer thickness and a thermally conductive compliant material layer thickness;
• the method further comprising curing the adhesive sealant layer;
• removing the objects through the one or more openings of the heat conducting device after the adhesive sealant layer is cured;
• and
• sealing the one or more openings of the heat conducting device using additional adhesive sealant.