Method for manufacturing a molded MMC multi media card package obtained with laser cutting
AssigneeSTMicroelectronics S.r.l.
InventorsRoberto Tiziani, Giovanni Frezza
Life of this patent
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Abstract
A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back side of the package, all around the package profile, and cutting the edges of said package by a laser cutting line passing through said groove. This new technique allows the use of all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.
Claims19
A method for manufacturing a fully molded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling, the method comprising:
- providing a rounded groove on a substrate back side of the package, all around the package profile;
- and
- cutting the corners of said package by a laser cutting line from the front side of the package passing through said groove such that resulting corners of the back side of the package comprise rounded edges.
A method, comprising:
- forming an integrated circuit attached to a support, the integrated circuit protruding from a front surface of the support;
- forming a sinusoidal groove in a back surface of the support;
- and
- cutting through the groove from the front surface of the support to separate the integrated circuit from the support, the separating resulting in a rounded edge of the back surface of the integrated circuit.
A method, comprising:
- forming an integrated circuit attached to a support, the integrated circuit protruding from a front surface of the support;
- forming a groove in a back surface of the support;
- and
- cutting from the front surface of the support through the groove to separate the integrated circuit from the support, such that a resulting corner of the back surface of the integrated circuit is substantially rounded.
Dependencies are inferred from the claim text.