Warpage control using a package carrier assembly
AssigneeFreescale Semiconductor, Inc.
InventorsYuan Yuan, Sheila F. Chopin
Life of this patent
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Abstract
A method for curing an encapsulant that surrounds a plurality of integrated circuits on a strip that forms a strip assembly is provided. The strip assembly is composed of units for packaging and the units each have edges defining a perimeter of the unit. The strip assembly is placed on a shelf. Pressure from deformable material or springs is applied to the strip assembly in regions of the strip. The regions are located at one of a group of locations consisting of along unit edges and centered between unit edges. Heat of sufficient temperature is applied for a sufficient duration to cure the encapsulant. The step of applying pressure continues during the application of heat for curing.
Claims9
A method for curing an encapsulant surrounding integrated circuits on a strip to form a strip assembly, wherein the strip assembly is composed of units for packaging and the units each have edges defining a perimeter of the unit, comprising:
- placing the strip assembly on a shelf;
- applying pressure to the strip assembly in regions of the strip assembly wherein the regions are located at one of a group consisting of along unit edges and centered between unit edges;
- and
- applying heat of sufficient temperature and for sufficient duration to cure the encapsulant while performing the step of applying pressure, wherein the encapsulant has raised molded areas around the integrated circuits with lower regions between the raised molded areas, wherein the step of applying pressure comprises applying the pressure in the lower regions with springs.
Dependencies are inferred from the claim text.