Flip chip laser bonding process

A flip chip bonder comprising:

• a bonding stage on which a substrate is placed;
• a bonding head for picking up a semiconductor chip and bonding the semiconductor chip on the substrate;
• and
• a chip heating apparatus for heating the semiconductor chip to a bonding temperature,
• wherein the chip heating apparatus comprises:
• a laser generator for emitting a laser beam to a semiconductor chip to heat the semiconductor chip;
• a beam intensity adjuster disposed in the laser emission path between the semiconductor chip and the laser generator to equalize the intensity of the laser beam to be emitted to the semiconductor chip throughout an emission region;
• wherein the chip heating apparatus further comprises an optical fiber connected to the laser generator to transfer the laser beam emitted from the laser generator to the beam intensity adjuster;
• the flip-chip bonder further comprising:
• a first barrel mounted with the optical fiber at an upper end part and provided with the beam intensity adjuster therein;
• a second barrel provided to slide in a vertical direction along an outer circumference of the first barrel;
• and
• a third barrel provided to slide in a vertical direction along an outer circumference of the second barrel and formed with a chip pickup part on a bottom thereof to pick up the semiconductor chip.