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US 7,803,511 B2Granted
Positive resist composition for immersion exposure and pattern-forming method using the same
AssigneeFUJIFILM Corporation
InventorsHaruki Inabe, Hiromi Kanda, Kunihiko Kodama
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Abstract
A positive resist composition for immersion exposure comprises: (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, wherein the acid satisfies conditions of V≧230 and V/S≦0.93 taking van der Waals volume of the acid as V (Å3), and van der Waals surface area of the acid as S (Å2).
Claims11
A positive resist composition for immersion exposure comprising:
- (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid,
- (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation,
- (C) a compound, other than compound (B), capable of generating an acid upon irradiation with actinic ray or radiation, and
- (D) a surfactant,
- wherein the acid generated by compound (B) satisfies conditions of V≧230 and V/S≦0.93 taking van der Waals volume of the acid as V (Å3), and van der Waals surface area of the acid as S (Å2)
- wherein the compound (B) is a sulfonium salt compound having an anion represented by formula (Y):
- in formula (Y), n3 represents an integer of from 3 to 6 and n4 represents an integer of from 3 to 6.
4 more elements
A positive resist composition for immersion exposure comprising:
- (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid, and
- (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation,
- wherein the acid satisfies conditions of V≧230 and V/S≦0.93 taking van der Waals volume of the acid as V (Å3), and van der Waals surface area of the acid as S (Å2)
- wherein the compound (B) comprises a sulfonium salt compound having an anion represented by formula (Y):
- in formula (Y), n3 represents an integer of from 3 to 6 and n4 represents an integer of from 3 to 6, and
- a sulfonium salt compound having an anion represented by formula (X):
- in formula (X), Rx represents an alkyl group, —OR′1, —C(═O)R′1, —C(═O)OR′1, —SO2R′1, or —SO3R′1;
- Ay represents a single bond, —SO2—, —SO3—, —SO2N(R′1) —, —CO2—, —C(═O)—, —C(═O)N(R′1)—, or an alkylene group;
- R′1 represents a hydrogen atom or an alkyl group;
- Az represents a monocyclic or polycyclic hydrocarbon group, or an aryl group;
- n1 represents an integer of from 1 to 4;
- and n2 represents an integer of from 1 to 4.
9 more elements
A pattern-forming method comprising:
- forming a resist film with a positive resist composition for immersion exposure comprising:
- (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid, and
- (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation,
- wherein the acid satisfies conditions of V≧230 and V/≦0.93 taking van der Waals volume of the acid as V (Å3), and van der Waals surface area of the acid as S (Å2);
- exposing the resist film through an immersion liquid so as to form an exposed resist film;
- and
- developing the exposed resist film
- and wherein the compound (B) is a sulfonium salt compound having an anion represented by formula (X):
- in formula (X), Rx represents an alkyl group, —OR′1, —C(═O)R′1, —C(═O)OR′1, —SO2R′1, or —SO3R′1;
- Ay represents a single bond, —SO2—, —SO3—, —SO2N(R′1)—, —CO2—, an oxygen atom, —C(═O)—, —C(═O)N(R′1)—, or an alkylene group;
- R′1 represents a hydrogen atom or an alkyl group;
- Az represents an aliphatic monocyclic or polycyclic hydrocarbon group;
- n1 represents an integer of from 1 to 4;
- and n2 represents an integer of from 1 to 4.
11 more elements
Dependencies are inferred from the claim text.