Al—Ni-rare earth element alloy sputtering target
AssigneesKobe Steel, Ltd., Kobelco Research Institute, Inc.
InventorsToshihiro Kugimiya, Katsutoshi Takagi, Hitoshi Matsuzaki, Kotaro Kitashita, Yoichiro Yoneda
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Abstract
An Al-base alloy sputtering target consisting Ni and one or more rare earth elements, wherein there are 5.0×104/mm2 or more compounds whose aspect ratio is 2.5 or higher and whose equivalent diameter is 0.2 μm or larger, when a cross sectional surface perpendicular to the plane of the target is observed at a magnification of 2000 or higher.
Claims11
An Al-based alloy sputtering target consisting of 2-4 at % Ni, 0.4-2 at % of a rare earth element selected from the group consisting of Nd, Y, and Dy, and the balance Al,
- wherein there are 5.0×104/mm2 or more compounds whose aspect ratio is 2.5 or higher and whose equivalent diameter is 0.2 μm or larger, when a cross sectional surface perpendicular to the plane of the target is observed at a magnification of 2000 or higher,
- wherein the amount of bending of the Al-base alloy sputtering target is 2 mm or less after holding at 250° C. for 1 hour, and
- wherein the Al-base alloy sputtering target is formed by spray forming with a nozzle diameter (φ) ranging from 3.0 to 5.5 mm and a gas pressure ranging from 0.6 to 0.9 MPa,
- wherein
- (a) the major axis direction of 80% or more of the compounds are within the range of ±30 degrees with respect to the direction which is parallel to the plane of the target, and
- (b) the number of bulky compounds whose equivalent diameter exceeds 5 μm is 500/mm2 or fewer, and
- wherein the orientation of the Al-base alloy sputtering target is controlled by rolling at a total processing rate of at least 60% and a processing rate per pass of at least 5%.
Dependencies are inferred from the claim text.