Monolithic shell for an optical electrical device
AssigneeFinisar Corporation
InventorsJoshua Moore, Gary Dean Sasser, Greta Light
Life of this patent
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Abstract
An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.
Claims18
An optoelectronic transceiver module comprising:
- a monolithic, one-piece module shell comprising:
- a top portion;
- a bottom portion;
- a first side portion;
- a second side portion;
- and
- a front portion;
- wherein the top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry;
- wherein the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion;
- wherein the front portion defines at least one of an optical transmit port or an optical receive port;
- and
- wherein the monolithic, one-piece module shell does not include one or more seams at the junctions of the top portion, bottom portion, first side portion, and second side portion such that any EMI produced by the electro-optical circuitry is substantially contained within the monolithic, one-piece module shell.
An optoelectronic transceiver module comprising:
- a monolithic, one-piece module shell comprising:
- a top portion;
- a bottom portion;
- a first side portion;
- a second side portion;
- and
- a front portion;
- wherein the top portion, bottom portion, first side portion, second side portion and the front portion define a cavity and wherein the monolithic, one-piece module shell does not include one or more seams;
- and
- a printed circuit board (PCB) carrier configured to be placed in the cavity of the monolithic, one-piece module shell, wherein the PCB carrier is configured to enclose a PCB having one or more optoelectronic circuits placed thereon.
Dependencies are inferred from the claim text.