Heat dissipation apparatus with heat pipes
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsYong-Dong Chen, Guang Yu, Shih-Hsun Wung, Chun-Chi Chen
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Abstract
A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm.
Claims13
A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, comprising:
- a conducting core having a heat-absorbing portion contacting with the heat-generating electronic component;
- a plurality of conducting arms extending radially and outwardly from the conducting core;
- a plurality of fins extending outwardly from the respective conducting arms;
- and
- a heat pipe assembly comprising a plurality of U-shaped heat pipes each having an evaporating section thermally attached to the heat-absorbing portion of the conducting core and a pair of upwardly extending condensing sections, at least one condensing section thermally coupled to the respective conducting arm.
Dependencies are inferred from the claim text.