Method of forming plating film, method of manufacturing magnetic device and method of manufacturing perpendicular magnetic recording head

A method of manufacturing a magnetic device having a magnetic film, the method comprising:

• a first step of forming a pattern film on a surface of a substrate, the pattern film having a first opening with an aspect ratio, which is a ratio of depth to width, greater than 1 and a second opening with an aspect ratio smaller than that of the first opening;
• a second step of forming a seed film so as to cover at least an exposed surface of the substrate in the first and the second openings and inner walls of the pattern film in the first and the second openings;
• and
• a third step of depositing the plating film of magnetic materials on the seed film in the first and the second openings through a process of filling at least the first opening while applying a magnetic field in the direction intersecting the surface of the substrate and a process of filling at least the second opening while applying a magnetic field in the direction along the surface of the substrate,
• wherein the magnetic film is formed to have a high aspect ratio portion of the plating film filling the first opening and a low aspect ratio portion of the plating film filling the second opening.

A method of manufacturing a perpendicular magnetic recording head with a thin film coil generating a magnetic flux and a magnetic pole layer leading the magnetic flux generated in the thin film coil to a magnetic recording medium, the method comprising:

• a first step of forming a pattern film on a surface of a substrate, the pattern film having a first opening with an aspect ratio, which is a ratio of depth to width, greater than 1 and a second opening with an aspect ratio smaller than that of the first opening;
• a second step of forming a seed film so as to cover at least an exposed surface of the substrate in the first and the second openings and inner walls of the pattern film in the first and the second openings;
• and
• a third step of depositing the plating film of magnetic materials on the seed film in the first and the second openings through a process of filling at least the first opening while applying a magnetic field in the direction intersecting the surface of the substrate and a process of filling at least the second opening while applying a magnetic field in the direction along the surface of the substrate,
• wherein the magnetic pole layer is formed to have a magnetic pole portion with a high aspect ratio of the plating film filling the first opening and a yoke portion with a low aspect ratio of the plating film filling the second opening.