Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

A diplexer for a multi-band wireless application, comprising:

• a Liquid Crystalline Polymer (LCP) layer having a first surface and a second surface opposite the first surface;
• a first patterned metal layer on the first surface of the LCP layer;
• a second patterned metal layer on the second surface of the LCP layer, wherein the first and second metal layers are patterned to form integrated components such that the first and second metal layers interact with one another to form a first filter and a second filter connected by a common port;
• a first prepreg layer on the first metal layer opposite the LCP layer, and a second prepreg layer on the second metal layer opposite the LCP layer;
• a first laminate layer on the first prepreg layer opposite the first metal layer, and a second laminate layer on the second prepreg layer opposite the second metal layer;
• a third metal layer on a first surface of the first laminate layer and patterned to form a first capacitor plate;
• and
• a fourth metal layer on a second surface of the first laminate layer opposite the first surface and patterned to form a second capacitor plate, wherein the first capacitor plate and second capacitor plate form a parallel plate capacitor.

A balun for a wireless application, comprising:

• a high K organic layer having a first surface and a second surface opposite the first surface;
• a first patterned metal layer on the first surface of the high K organic layer;
• a second patterned metal layer on the second surface of the high K organic layer, wherein the first and second metal layers are patterned to form integrated components such that the first and second metal layers interact with one another to form a first passive device and a second passive device;
• a first prepreg layer on the first metal layer opposite the high K organic layer, and a second prepreg layer on the second metal layer opposite the high K organic layer;
• a first outer organic layer on the first prepreg layer opposite the first metal layer, and a second outer organic layer on the second prepreg layer opposite the second metal layer, wherein the first metal layer is patterned to form a first capacitor plate and the second metal layer is patterned to form a second capacitor plate;
• and
• a third metal layer on the first outer organic layer patterned to form a third capacitor plate, wherein the first, second and third capacitor plates form a capacitor.

A signal processing module for multi-band wireless applications, comprising:

• a first Liquid Crystalline Polymer (LCP) layer having a first surface and a second surface opposite the first surface;
• a first patterned metal layer on the first surface of the first LCP layer;
• a second patterned metal layer on the second surface of the first LCP layer;
• a second LCP layer having a first surface and a second surface opposite the first surface;
• a third patterned metal layer on the first surface of the second LCP layer;
• a fourth patterned metal layer on the second surface of the second LCP layer, wherein the first, second, third and fourth metal layers are patterned to form integrated components, the integrated components comprising at least a first filter and a second filter connected by a common port;
• a first prepreg layer disposed between the first and second LCP layers;
• a second prepreg layer on the second metal layer opposite the first LCP layer, and a third prepreg layer on the third metal layer opposite the second LCP layer;
• and
• a first outer organic layer on the second prepreg layer opposite the second metal layer, and a second outer organic layer on the third prepreg layer opposite the third metal layer.

A signal processing module, comprising:

• an unfilled Liquid Crystalline Polymer (LCP) layer having a first surface and a second surface opposite the first surface;
• a first patterned metal layer on the first surface of the LCP layer;
• a second patterned metal layer on the second surface of the LCP layer, wherein the first and second metal layers are patterned to form at least a first resonator, a second resonator, a third resonator, and a feedback capacitor, the third resonator connecting the first and second resonators, and the feedback capacitor connected in parallel with the third resonator;
• a first prepreg layer on the first metal layer opposite the LCP layer and a second prepreg layer on the second metal layer opposite the LCP layer;
• a first laminate layer on the first prepreg layer opposite the first metal layer, and a second laminate layer on the second prepreg layer opposite the second metal layer.