US 7,795,721 B2 · Semiconductor device and method for manufacturing the same

Abstract

The semiconductor device 100 comprises a first semiconductor element 113 provided on a face on one side of a flat plate shaped interconnect component 101, an insulating resin 119 covering a face of a side where the first semiconductor element 113 of the interconnect component 101 is provided and a side face of the first semiconductor element 113, and a second semiconductor element 111 provided on a face on the other side of the interconnect component 101. The interconnect component 101 has a constitution where an interconnect layer 103, a silicon layer 105 and an insulating film 107 are sequentially formed. The interconnect layer 103 has a constitution where the interconnect layer 103 has a flat plate shaped insulating component and a conductive component extending through the insulating component. The first semiconductor element 113 is electrically connected with the second semiconductor element 111 through the conductive component.

Claims30

Dependent claims

A semiconductor device comprising:

an interconnect component in a shape of a flat plate, said interconnect component comprising an interconnect layer only on one side thereof, said interconnect layer having an insulating component and an interconnect, a support layer supporting said interconnect layer, and a through electrode, which extends through said support layer, connecting with said interconnect layer;
a first semiconductor element provided on said one side of said interconnect component, said first semiconductor element being connected with said interconnect layer;
a resin covering an entirety of exposed portions of said one side of said interconnect component so as to cover an entirety of exposed portions of said interconnect layer, and said resin covering an entirety of a side face of said first semiconductor element;
and
a second semiconductor element provided on a face on an other side of said interconnect component,
wherein said first semiconductor element is electrically connected with said second semiconductor element through said interconnect component.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor device and method for manufacturing the same

Life of this patent

Semiconductor device and method for manufacturing the same

Life of this patent

Abstract

Claims30