Material processing system and a material processing method including a saw station and an interface with touch screen

A method of cutting material comprising

• providing an apparatus including a processing path, a saw station located along the processing path, a positioner configured to push a trailing end of a work piece along the processing path toward the saw station, and a controller connected to the apparatus programmed to provide a digital interface allowing an operator to control operation of the apparatus through the interface, the interface including a display screen having a set of keys, a key customizing field and a numerical key pad field, each key being customizable for a particular application by touching the key customizing field and the numerical key pad field to affect a selected movement function of the positioner along the processing path,
• selecting a movement function for affecting movement of the positioner, and assigning the selected movement function to a key in the display field,
• inputting data to the controller indicating a length of a work piece to be processed,
• initiating the movement function on the positioner by actuating the key,
• tracking location of the work piece relative to the saw station based on the location of the positioner along the processing path and the known length of the work piece, and
• cutting the work piece at the saw station when the work piece has been pushed to an appropriate position for cutting the work piece into desired dimensions.