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US 7,791,185 B2Granted
Pin grid array package substrate including pins having curved pin heads
AssigneeIntel Corporation
InventorMengzhi Pang
Life of this patent
Estimating the term…
Abstract
An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface.
Claims5
A microelectronic package substrate comprising:
- a die-side surface adapted to receive a die thereon;
- a PCB-side surface adapted to be mechanically and electrically bonded to a PCB;
- an array of land pads on the PCB-side surface;
- an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, each of the pins having a pin stem and a pin head attached to the pin stems the pin head being mounted onto a corresponding land pad, at least some pin heads having a shape selected from the group consisting of a spherical volume and an elliptical volume;
- and
- a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.
3 more elements
An electrically conductive pin comprising:
- a pin stem;
- and
- a pin head attached to the pin stem, the pin head being adapted to be mounted by way of pin-attach solder onto a surface of a microelectronic substrate to support the pin stem said pin head having a shape selected from a spherical volume and an elliptical volume, the pin head having an underside surface defining a continuous curve configured to allow gases to escape from the pin-attach solder adjacent the underside surface.
Dependencies are inferred from the claim text.