Organic electroluminescence display and method of producing same
AssigneeCanon Kabushiki Kaisha
InventorKatsumi Nakagawa
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Abstract
There is provided an organic electroluminescence display includes a lower electrode formed on a substrate, a device separation film formed on the lower electrode, an organic compound layer formed on the device separation film and including a light emission layer, and an upper electrode formed on the organic compound layer, wherein the device separation film is a polyimide film having an imidation ratio in a range of 65% or more to less than 90%. The display is expected to have longer operating life.
Claims8
An organic electroluminescence display comprising:
- a drive circuit formed on a substrate;
- a planarization film formed on the drive circuit;
- a lower electrode formed on the planarization film;
- a device separation film formed on the lower electrode;
- an organic compound layer formed on the device separation film and including a light emission layer;
- and
- an upper electrode formed on the organic compound layer,
- wherein (i) at least one of the planarization film and the device separation film comprises a polyimide film having an imidation ratio in a range of 65% or more to less than 90% and (ii) the device separation film has a glass transition temperature higher than that of the planarization film.
A method of producing an organic electroluminescence display comprising the steps of:
- forming a drive circuit on a substrate;
- forming a planarization film on the drive circuit;
- forming a lower electrode on the planarization film;
- forming a device separation film on the lower electrode;
- forming an organic compound layer including a light emission layer on the device separation film;
- and
- forming an upper electrode on the organic compound layer, wherein:
- at least one of the step of forming a planarization film and the step of forming a device separation film comprises applying a polyimide precursor solution mainly composed of a polyamic acid, pre-baking the applied solution to form a polyimide precursor film, and post-baking the polyimide precursor film to form a polyimide film;
- a rate of temperature increase up to a pre-baking maximum ultimate temperature is 8° C./min or less;
- a post-baking maximum ultimate temperature is in a range of a glass transition temperature of the polyimide film or more to less than +40° C. of the glass transition temperature, and
- the device separation film has a glass transition temperature higher than that of the planarization film.
Dependencies are inferred from the claim text.