# US 7,785,440 B2 · Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,785,440 B2 - Document ID: US7785440B2 - Status: Granted - Kind: B2 - Application number: 11/210,405 - Filed: 2005-08-23 - Published: 2005-12-22 - Granted: 2010-08-31 - Earliest claimed: 2002-05-13 - Assignees: State of Oregon acting by and through the Oregon State Board of Higher Education on behalf of Oregon State University - Inventors: Kaichang Li - Web page: https://patentgrep.com/patent/US7785440B2 ## CPC - C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers - B27N 3/002: {characterised by the type of binder (compositions of macromolecular compounds C08L)} - C08L 93/00: Compositions of natural resins; Compositions of derivatives thereof (of polysaccharides C08L1/00 - C08L5/00; of natural rubber C08L7/00) - C09J 2400/283: in the substrate - C09J 2493/00: Presence of natural resin - Y10T 428/31971: Of carbohydrate - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - B27N: MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL (containing cementitious material B28B; shaping of substances in a plastic state B29C; fibreboards made from fibrous suspensions D21J; drying F26B17/00) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a soy protein or lignin and (ii) at least one substantially formaldehyde-free curing agent that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the soy protein. A second variant of the method involves using an adhesive composition that comprises a reaction product of (i) a protein or lignin, (ii) a first compound that includes at least one amine, amide, imine, imide or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the protein and (iii) a curing agent. ## Claims ### Claim 1 A substantially formaldehyde-free adhesive composition comprising a reaction product of: soy flour; and at least one resin comprising an adduct of epichlorohydrin with a polyamidoamine resin. ### Claim 2 (depends on 1) The adhesive composition of claim 1, further comprising wheat flour. ### Claim 3 A substantially formaldehyde-free adhesive composition, wherein the composition is made from the following ingredients: soy flour; and at least one resin comprising an adduct of epichlorohydrin with a polyamidoamine resin. ### Claim 4 (depends on 3) The adhesive composition of claim 3, further comprising wheat flour. ### Claim 5 (depends on 1) The adhesive composition of claim 1, wherein the adduct is a reaction product of poly(adipic acid-co-diethylenetriamine) and epichlorohydrin. ### Claim 6 (depends on 3) The adhesive composition of claim 3, wherein the adduct is a reaction product of poly(adipic acid-co-diethylenetriamine) and epichlorohydrin. ### Claim 7 (depends on 1) The adhesive composition of claim 1, wherein the adduct includes a nitrogen-containing, 4-member ring, functional group represented by: ### Claim 8 (depends on 3) The adhesive composition of claim 3, wherein the adduct includes a nitrogen-containing, 4-member ring, functional group represented by: ### Claim 9 (depends on 1) The adhesive composition of claim 1, wherein the adhesive composition comprises an aqueous solution of the reaction product. ### Claim 10 (depends on 3) The adhesive composition of claim 3, wherein the adhesive composition comprises an aqueous solution of the reaction product. ### Claim 11 (depends on 3) The adhesive composition of claim 3, wherein the adhesive composition is prepared by mixing an aqueous soy flour solution with an aqueous solution of the adduct. ### Claim 12 (depends on 11) The adhesive composition of claim 11, wherein the mix ratio of soy flour to the adduct is about 1:1 to about 1:0.05, based on dry weight. ### Claim 13 (depends on 3) The adhesive composition of claim 3, wherein the soy flour is mixed with the adduct, and the mix ratio of soy flour to the adduct is 1:1 to 1000:1. ### Claim 14 (depends on 3) The adhesive composition of claim 3, wherein the soy flour is mixed with the adduct, and the mix ratio of soy flour to the adduct is 1:1 to 100:1. ### Claim 15 (depends on 3) The adhesive composition of claim 3, wherein the soy flour is mixed with the adduct, and the mix ratio of soy flour to the adduct is 1.33:1 to 100:1. ### Claim 16 (depends on 1) The adhesive composition of claim 1, wherein the adhesive composition has a solids content of about 20 to about 60 weight percent. ### Claim 17 (depends on 3) The adhesive composition of claim 3, wherein the soy flour is mixed with the adduct, and the resulting mixture has a solids content of about 20 to about 60 weight percent. ### Claim 18 (depends on 14) The adhesive composition of claim 14, wherein the resulting mixture has a solids content of about 20 to about 60 weight percent. ### Claim 19 (depends on 5) The adhesive composition of claim 5, wherein the adhesive composition has a solids content of about 20 to about 60 weight percent. ### Claim 20 A substantially formaldehyde-free composition, comprising a mixture of at least: (a) soy flour; (b) at least one resin comprising an adduct of epichlorohydrin with a polyamidoamine resin; and (c) comminuted lignocellulosic particles, wherein the soy flour and the resin form an adhesive that binds the comminuted lignocellulosic particles into a densified mass. ### Claim 21 (depends on 20) The composition of claim 20, wherein components (a) and (b) are pre-mixed prior to mixing with component (c). ### Claim 22 (depends on 20) The composition of claim 20, wherein the adduct is a reaction product of poly(adipic acid-co-diethylenetriamine) and epichlorohydrin. ### Claim 23 (depends on 20) The composition of claim 20, wherein the comminuted lignocellulosic particles are in a form of chips, flakes, fibers, strands, wafers, trim, shavings, sawdust, straw, stalks or shives. ### Claim 24 (depends on 20) The composition of claim 20, wherein the comminuted lignocellulosic particles are in a form of chips, flakes, wafers, trim, shavings, sawdust, straw, stalks or shives.