Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing

A computer-implemented system of measuring at least one manufacturing characteristic for at least one wafer from a lot of wafers manufactured by a manufacturing process, comprising:

• a memory to store information representative of a set of candidate points to be measured by the manufacturing process on the at least one wafer from the lot of wafers, and information representative of a plan for performing measurements on the at least one wafer from the lot of wafers to measure the at least one manufacturing characteristic, the plan defining at least one of:
• which of the wafers in the lot of wafers are to be measured and which candidate points on the wafers to be measured to make measurements on;
• and
• a processor, coupled to the memory, programmed to
• detect one of a plurality of events or a lack of one of the plurality of events indicating a change in the manufacturing process, the change pertaining to at least one of:
• receiving new material in the manufacturing process, and detecting a change in a control parameter in the manufacturing process;
• and
• adjust the plan for performing measurements on the at least one product from the lot of wafers based on the detected change while the lot of wafers is being processed, wherein adjusting the plan includes at least one of:
• adjusting which wafers in the lot of wafers are to be measured and adjusting which candidate points on the wafers to be measured to make measurements on.

A tangible computer readable medium for storing executable instructions which when executed on a processing system cause the processing system to perform a method for measuring at least one manufacturing characteristic for at least one wafer from a lot of wafers manufactured by a manufacturing process, the method comprising:

• providing information representative of a set of candidate points to be measured by the manufacturing process on the at least one wafer from the lot of wafers;
• executing, by a computer system, a plan for performing measurements on the at least one wafer from the lot of wafers to measure the at least one manufacturing characteristic, the plan defining at least one of:
• which of the wafers in the lot of wafers are to be measured and which candidate points on the wafers to be measured to make measurements on;
• detecting, by the computer system, one of a plurality of events or a lack of one of the plurality of events indicating a change in the manufacturing process, the change pertaining to at least one of:
• receiving new material in the manufacturing process, and detecting a change in a control parameter in the manufacturing process;
• and
• adjusting, by a computer system, the plan for performing measurements on the at least one product from the lot of wafers based on the detected change while the lot of wafers is being processed, wherein adjusting the plan includes at least one of:
• adjusting which wafers in the lot of wafers are to be measured and adjusting which candidate points on the wafers to be measured to make measurements on.