System and method for polishing surface of tape-like metallic base material

A polishing system for continuously polishing a target surface of a tape-shaped metallic base material, said base material, an intermediate layer with controlled crystalline orientation on said target surface of said base material and a superconducting oxide layer on said intermediate layer together being adapted to form a superconducting oxide member, said polishing system comprising:

• a feeding device for causing said base material to travel continuously;
• a pressing device for applying a specified tension in said base material;
• a first polishing device for carrying out an initial polishing of said target surface by performing a random rotational polishing and thereby removing scratches, protrusions or crystalline defects on said target surface generated on said base material by a rolling process;
• and
• a second polishing device for carrying out a final polishing on said target surface in the direction of travel of said base material and thereby increasing crystalline directionality in a longitudinal direction of said base material and flattening said target surface wherein polishing marks are formed in said direction of travel on said target surface by said final polishing.