Back to results
US 7,772,880 B2Granted
Reprogrammable three dimensional intelligent system on a chip
OwnerNeal Solomoninventor
Life of this patent
Estimating the term…
Abstract
A high performance 3D semiconductor is described with cubic dimensional multi-node reprogrammable components for multi-functionality and intelligent behaviors. The system is modeled with dynamic EDA techniques. Applications of the intelligent SoC are specified, particularly embedded, multifunctional, DSP and high-performance computing applications.
Claims6
A system for organizing multilayer integrated circuit (IC) nodes in a three dimensional (3D) system on a chip (SoC), comprising:
- 35 3D hybrid IC nodes organized in a network configuration;
- wherein the nodes are organized to process data and instructions;
- wherein the IC nodes are hybrid semiconductors consisting of microprocessors, complex programmable logic devices, ASICs and memory components;
- wherein the IC nodes are linked to each other;
- wherein 34 of the IC nodes are organized in neighborhood clusters;
- wherein 1 of the IC nodes is a central controller node;
- wherein the configuration of each neighborhood cluster varies with specific tasks;
- wherein the 3D SoC receives signals from exogenous sources;
- and
- wherein the 3D SoC controls device applications.
7 more elements
Dependencies are inferred from the claim text.