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US 7,772,039 B2Granted
Procedure for arranging chips of a first substrate on a second substrate
AssigneeInfineon Technologies AG
InventorMartin Kerber
Life of this patent
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Abstract
The invention relates to a method for arranging chips of a first substrate on a second substrate, in which the chips are grouped at least into first chips and into second chips, the first chips of the first substrate are singulated and the singulated first chips are arranged on the second substrate in such a way that each of the first chips on the second substrate is unambiguously assigned to the associated first chip on the first substrate.
Claims19
A method for arranging chips of a first substrate on a second substrate and a third substrate, the method comprising:
- grouping the chips at least into first chips and into second chips;
- singulating the first and second chips of the first substrate;
- arranging the singulated first chips congruently on the second substrate in such a way that each of the first chips on the second substrate is assigned in a one to one manner to the associated first chip on the first substrate;
- and
- arranging the singulated second chips congruently on the third substrate in such a way that each of the second chips on the third substrate is assigned in a one to one manner to the associated second chip on the first substrate.
2 more elements
Dependencies are inferred from the claim text.