Quantum photonic imagers and methods of fabrication thereof

A method of making emissive multicolor digital image fowling devices comprising:

• a) forming a wafer of two dimensional arrays of multicolor laser emitting pixels whereby each multicolor laser emitting pixel comprises a plurality of laser diode semiconductor structures, each for emitting a different color, stacked vertically with a grid of vertical sidewalls electrically and optically separating each multicolor pixel from adjacent multicolor pixels within the array of multicolor pixels, a plurality of vertical waveguides optically coupled to the laser diode semiconductor structures to vertically emit laser light generated by the laser diode semiconductor structures from a first surface of the stack of laser diode semiconductor structures, and a plurality of contact pads providing electrical contact to each laser diode semiconductor structure;
• b) forming a wafer of digital semiconductor structures, each having a plurality of digital semiconductor circuits in the respective digital semiconductor structure, each electrically coupled to receive control signals from the periphery of the digital semiconductor structure and electrically coupled to contact pads to separately control on/off states of each of the multicolor laser diode semiconductor structures that may be connected thereto;
• c) wafer-level bonding the wafer of two dimensional arrays of multicolor laser emitting pixels and the wafer of digital semiconductor structures contact pad side to contact pad side;
• d) etching through the photonic semiconductor structure of between pixel regions to expose the device contact pads;
• and
• e) cutting the multi wafer into dies to form multiple emissive multicolor digital image forming devices.

The method of making a two dimensional array of multicolor light emitting pixels wherein each light emitting pixel comprises a plurality of diode semiconductor structures, each for emitting a different color, stacked vertically with a grid of vertical sidewalls electrically and optically separating each multicolor pixel from adjacent multicolor pixels within the array of multicolor pixels, and a plurality of vertical waveguides optically coupled to the diode semiconductor structures to vertically emit light generated by the diode semiconductor structures from a first surface of the stack of semiconductor structures;

• the method comprising:
• a) forming diode semiconductor structures for emitting different colors, each having multiple semiconductor layers of one or more of the following semiconductors alloy materials:
• AlxIn1-xP, (AlxGa1-x)yIn1-yP, GaxIn1-xP, AlxGa1-xN, AlxGa1-xN/GaN, InxGa1-xN, GaN, each formed on a separate wafer over a thick substrate layer of either GaAs, GaN or InGaN, each including an n-type etch-stop layer and a p-type contact layer of the same respective semiconductor substrate layer material type, each comprising n-type and p-type waveguide layers and cladding layers that define their respective optical confinement regions, each having at least one quantum well surrounded by two barrier layers that define their respective active regions, and each comprising an electron blocker layer embedded either within their respective p-type waveguide layers or between their respective p-type waveguide and cladding layers;
• b) depositing a SiO2 layer upon a Si-substrate wafer;
• c) depositing an n-contact metal layer over the SiO2 layer;
• d) wafer-level bonding of the p-type contact layer of a diode semiconductor structure wafer of one color to the deposited n-contact metal layer and etching its GaAs, GaN or InGaN thick substrate down to its n-type etch-stop layer;
• e) etching a grid of trenches with vertical sidewalls down to the n-contact metal layer and backfilling the etched trenches with SiO2;
• f) etching the trenches for vertical interconnect metal vias and backfilling etched trenches with metal;
• g) depositing a p-contact metal layer and etching the sidewall trenches;
• and
• h) depositing another SiO2 layer;
• i) repeating b) through h) for each additional color of diode semiconductor structure to be incorporated within the two dimensional array of multicolor light emitting pixels;
• j) depositing and etching a metal layer to form contact pads and refilling etched gaps with SiO2;
• k) etching openings for the vertical waveguides though the Si-substrate side;
• l) depositing thin cladding layers on the interior walls of openings;
• and
• m) either backfilling the interior of the openings remaining internal to the thin cladding layers with a dielectric material or leaving them air filled.

A method of making emissive multicolor digital image founing devices comprising:

• a) founing a wafer of two dimensional arrays of multicolor light emitting pixels whereby each multicolor light emitting pixel comprises a plurality of diode semiconductor structures, each for emitting a different color, stacked vertically with a grid of vertical sidewalls electrically and optically separating each multicolor pixel from adjacent multicolor pixels within the array of multicolor pixels, a plurality of vertical waveguides optically coupled to the diode semiconductor structures to vertically emit light generated by the diode semiconductor structures from a first surface of the stack of diode semiconductor structures, and a plurality of contact pads providing electrical contact to each diode semiconductor structure;
• b) forming a wafer of digital semiconductor structures, each having a plurality of digital semiconductor circuits in the respective digital semiconductor structure, each electrically coupled to receive control signals from the periphery of the digital semiconductor structure and electrically coupled to contact pads to separately control on/off states of each of the multicolor diode semiconductor structures that may be connected thereto;
• c) wafer-level bonding the wafer of two dimensional arrays of multicolor light emitting pixels and the wafer of digital semiconductor structures contact pad side to contact pad side;
• d) etching through the photonic semiconductor structure between pixel regions to expose the device contact pads;
• and
• e) cutting the multi wafer into dies to form multiple emissive multicolor digital image forming devices.