Strippable cable shield compositions

A conductive cable comprising:

• a centrally located conductive core;
• an insulation layer external to said conductive core;
• and
• a strippable semiconductive insulation shield layer in contact with an outermost surface of said insulation layer, said insulation shield layer comprising;
• 40 to 85 weight percent, based upon the weight average molecular weight of not more than 200,000;
• and
• an adhesion modifying additive system comprising at least two components, each of said an adhesion modifying additive system components being different from said base polymer, said first component comprising a hydrocarbon wax or ethylene vinyl acetate wax and said second component comprising an amide wax;
• and
• 5 to 45 weight percent, based upon the weight of the semiconductive resin composition, of a conductive carbon black.

A semiconductive composition for use as a strippable semiconductive insulation shield layer in contact with an outermost surface of a wire and cable insulation layer, said composition comprising;

• 40 to 85 weight percent, based upon the weight of the semiconductive composition, of a base polymer having a weight average molecular weight of not more than 200,000;
• and wherein the base polymer is a copolymer of ethylene and a mono-unsaturated ester where the mono-unsaturated ester content is between 28% and 40%;
• and
• an adhesion modifying additive system comprising at least two components, each of said adhesion modifying additive system components being different from said base polymer, said first component comprising a hydrocarbon wax or ethylene vinyl acetate wax and said second component comprising an amide wax;
• and
• 5 to 45 weight percent, based upon the weight of the semiconductive resin composition, of a conductive carbon black.

A semiconductive composition for use as a strippable semiconductive insulation shield layer in contact with an outermost surface of a wire and cable insulation layer, said composition comprising:

• 40 to 85 weight percent, based upon the weight of the semiconductive composition, of a base polymer having a weight average molecular weight of not more than 200,000;
• and
• an adhesion modifying additive system comprising at least two components, each of said adhesion modifying additive system components being different from said base polymer, said first component comprising a hydrocarbon wax or ethylene vinyl acetate wax and said second component comprising an amide wax;
• and
• 5 to 45 weight percent, based upon the weight of the semiconductive resin composition, of a conductive carbon black;
• wherein the semiconductive composition gives an adhesion result on plaques of less than about 8.0 pounds per ½ inch.