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US 7,763,962 B2Granted
Wafer-level packaging of micro devices
AssigneeSpatial Photonics, Inc.
InventorsShaoher X. Pan, Vlad Novotny
Life of this patent
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Abstract
An encapsulated device includes a micro device on a substrate, a cover bonded to the substrate thereby forming a chamber to encapsulate the micro device, and a desiccant material on the cover and in the chamber. An anti-stiction material is absorbed in the desiccant material.
Claims9
An encapsulated device, comprising:
- a micro device on a substrate;
- a cover bonded to the substrate thereby forming a chamber to encapsulate the micro device;
- and
- a desiccant material in the chamber, wherein the desiccant material is porous and an anti-stiction material is absorbed in pores of the desiccant material.
1 more element
Dependencies are inferred from the claim text.