Vibration-induced die detachment system
AssigneeASM Assembly Automation Ltd.
InventorsYiu Ming Cheung, Man Kit Chow
Life of this patent
Estimating the term…
Abstract
A die is detachable from an adhesive tape on which the die is mounted with a die detachment tool comprising a vacuum enclosure that is operative to provide a vacuum suction on the adhesive tape. One or more ejector pins are housed in the vacuum enclosure and are projectable from the vacuum enclosure for lifting the die and adhesive tape. A vibrational tool is housed in the vacuum enclosure adjacent to the ejector pins and it is projectable from the vacuum enclosure to contact a portion of the adhesive tape at which the die is located. The vibrational tool is further operative to oscillate the adhesive tape and die for promoting delamination of the die from the adhesive tape.
Claims17
A die detachment tool for detaching a die from an adhesive tape on which the die is mounted, comprising:
- a vacuum enclosure that is operative to provide a vacuum suction on the adhesive tape;
- one or more ejector pins housed in the vacuum enclosure which are projectable from the vacuum enclosure for lifting the die and adhesive tape;
- and
- a vibrational tool housed in the vacuum enclosure adjacent to the ejector pins and which is projectable from the vacuum enclosure to contact a portion of the adhesive tape at which the die is located, the vibrational tool being operative to oscillate the adhesive tape and die for promoting delamination of the die from the adhesive tape.
Dependencies are inferred from the claim text.