Method for manufacturing a surface and integrated circuit using variable shaped beam lithography

A method for manufacturing an integrated circuit using an optical lithographic process, the optical lithographic process using a reticle, the method comprising:

• inputting a desired pattern to be formed on the reticle;
• determining a plurality of variable shaped beam (VSB) shots, wherein shots in the plurality of shots are allowed to overlap each other, and wherein the union of any subset of the plurality of VSB shots, each shot in the subset being oversized or being undersized or being the originally-determined size, is different than the desired pattern;
• calculating a calculated pattern on the reticle from the plurality of VSB shots;
• revising the plurality of VSB shots and recalculating the calculated pattern if the calculated pattern differs from the desired pattern by more than a predetermined tolerance;
• and
• forming the pattern on the reticle with the plurality of VSB shots.

A method for manufacturing an integrated circuit, the integrated circuit having a substrate, the method comprising:

• inputting a desired pattern to be formed on the substrate;
• determining a plurality of variable shaped beam (VSB) shots, wherein shots in the plurality of shots are allowed to overlap each other, and wherein the union of any subset of the plurality of VSB shots, each shot in the subset being oversized or being undersized or being the originally-determined size, is different than the desired pattern;
• calculating a calculated pattern on the substrate from the plurality of VSB shots;
• revising the plurality of VSB shots and recalculating the calculated pattern if the calculated pattern differs from the desired pattern by more than a predetermined tolerance;
• and
• forming the pattern on the substrate with the plurality of VSB shots.