High speed, high density electrical connector
AssigneeAmphenol TCS
InventorsThomas S. Cohen, Brian Kirk, Marc B. Cartier, Jr.
Life of this patent
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AssigneeAmphenol TCS
InventorsThomas S. Cohen, Brian Kirk, Marc B. Cartier, Jr.
Estimating the term…
An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
An electrical connector comprising at least one lead frame and at least one housing, each lead frame of the at least one lead frames comprising:
A wafer for an electrical connector, the wafer comprising:
An electrical connector including a plurality of columns, the electrical connector comprising:
Dependencies are inferred from the claim text.