System and method of forming a low profile conformal shield
AssigneeGeneral Electric Company
InventorsChristopher James Kapusta, Donald Cunningham, Richard Joseph Saia
Life of this patent
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Abstract
A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.
Claims18
A method of forming a conformal shield, comprising:
- applying a conformal insulating coating to an electrical system;
- forming a plurality of openings in the insulating coating at desired locations;
- depositing a first metallic layer over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the electrical system at the desired locations;
- depositing a second metallic layer onto the first metallic layer;
- and
- wherein the method further comprises:
- applying a protective coating onto a back surface of the electrical system prior to depositing the first metallic layer;
- and
- removing the protective coating from the back surface of the electrical system subsequent to depositing of the second metallic layer.
A method for manufacturing a conformal shield, comprising:
- applying an ultraviolet-curable polymer coating to a circuit board;
- forming an opening in the polymer coating adjacent to each of a plurality of contact pads on the circuit board;
- depositing a conductive layer over the polymer coating and in the opening adjacent to each of the plurality of contact pads, the conductive layer being electrically coupled to the circuit board at the plurality of contact pads;
- and
- increasing a thickness of the conductive layer to increase at least one of a radio frequency (RF) shielding property and an electromagnetic (EM) shielding property of the conductive layer;
- and
- wherein the method further comprises:
- applying a protective coating onto a back surface of the circuit board prior to depositing the conductive layer;
- and
- removing the protective coating from the back surface of the circuit board subsequent to electroplating the second metallic layer.
A method of forming a conformal shield, comprising:
- applying a conformal insulating coating to an electrical system, wherein applying the conformal insulating coating comprises:
- placing a thermoplastic film over the electrical system;
- positioning a silicone layer over the thermoplastic film;
- and
- applying heat and pressure to the thermoplastic film and the silicone layer to shape the thermoplastic film so as to conform to the electrical system;
- forming a plurality of openings in the thermoplastic film at desired locations;
- depositing a first metallic layer over the thermoplastic film and in each of the plurality of openings, the first metallic layer being electrically connected with the electrical system at the desired locations;
- and
- depositing a second metallic layer onto the first metallic layer.
Dependencies are inferred from the claim text.