Method of making wired circuit board holding sheet

A production method of a wired circuit board holding sheet which is in the form of a sheet holding therein a plurality of separable wired circuit boards, the method comprising:

• preparing the wired circuit board holding sheet wherein the wired circuit boards are held in the sheet via at least one joint which is operative to be cut, and
• forming in a first surface of the joint a cutting notch having a first depth to facilitate cutting of the joint and a marking notch having a second depth that is less than the first depth to indicate that the cutting notch has a predetermined depth,
• wherein the cutting notch and the marking notch are formed simultaneously by using a punch comprising a combination of a main punch portion and a sub-punch portion, the main punch portion having a tip that extends beyond a tip of the sub-punch portion, and wherein the main punch portion is used to form the cutting notch and the sub-punch portion is used to form the marking notch.