MEMS device having support structures configured to minimize stress-related deformation and methods for fabricating same

A MEMS device, comprising:

• a substrate;
• an electrode layer located over the substrate;
• a movable layer located over the electrode layer, wherein the movable layer is generally spaced apart from the electrode layer by an air gap, wherein the movable layer comprises a reflective sublayer and a mechanical sublayer, the reflective sublayer on the side of the movable layer facing the electrode layer, and wherein the reflective sublayer comprises a different material than the mechanical sublayer;
• and
• rigid support structures formed vertically adjacent the movable layer such that the support structures and the movable layer overlap one another within a support post region, wherein the support structures comprise a first sublayer comprising the same material as the mechanical sublayer and a second sublayer comprising the same material as the reflective sublayer, the first and second sublayers formed of different materials.

An electromechanical device, comprising:

• a substrate;
• an electrode layer located over the substrate;
• a plurality of rigid support structures each comprising a first sublayer of a first material and a second sublayer of a second material, the first and second materials being different from one another;
• and
• a movable layer extending over at least a portion of the rigid support structures, wherein the movable layer is generally spaced apart from the electrode layer by an air gap, wherein the movable layer comprises a reflective sublayer and a mechanical sublayer, the reflective sublayer on the side of the movable layer facing the electrode layer, wherein the reflective sublayer comprises the first material and the mechanical sublayer comprises the second material.