# US 7,746,537 B2 · MEMS devices and processes for packaging such devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,746,537 B2 - Document ID: US7746537B2 - Status: Granted - Kind: B2 - Application number: 11/734,730 - Filed: 2007-04-12 - Published: 2007-10-18 - Granted: 2010-06-29 - Earliest claimed: 2006-04-13 - Assignees: QUALCOMM MEMS Technologies, Inc. - Inventors: Bangalore R. Natarajan; Surya Ganti - Web page: https://patentgrep.com/patent/US7746537B2 ## CPC - G02B 27/0006: {with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation (G02B1/18 takes precedence; cleaning in general B08B)} - B81C 1/00285: {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters} - G02B 26/001: {based on interference in an adjustable optical cavity (interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26)} - G02B 26/0841: {the reflecting element being moved or deformed by electrostatic means} - B81B 2201/047: Optical MEMS not provided for in B81B2201/042 - B81B2201/045 - B81C 2203/0145: Hermetically sealing an opening in the lid - B81C 2203/019: characterised by the material or arrangement of seals between parts - B81C 2203/032: Gluing - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to the transparent substrate with a seal. The interferometric modulator array may be exposed to the surrounding environment through an opening in either the backplate or the seal. ## Claims ### Claim 1 A microelectromechanical systems (MEMS) based device, comprising: a transparent substrate having a MEMS device formed thereon; a first backplate sealed to said transparent substrate, the first backplate comprising at least one orifice; and a second backplate joined to said first backplate, and comprising at least one desiccant area, wherein said at least one desiccant area is exposed to said MEMS device through said at least one orifice. ### Claim 2 (depends on 1) The device of claim 1, wherein said transparent substrate comprises glass. ### Claim 3 (depends on 1) The device of claim 1, wherein said first backplate comprises glass. ### Claim 4 (depends on 1) The device of claim 1, wherein the second backplate comprises glass or metal. ### Claim 5 (depends on 1) The device of claim 1, wherein the MEMS device comprises an interferometric modulator. ### Claim 6 (depends on 1) The device of claim 1, further comprising: a processor that is in electrical communication with said microelectromechanical systems device, said processor being configured to process image data; and a memory device in electrical communication with said processor. ### Claim 7 (depends on 6) The device of claim 6, further comprising a driver circuit configured to send at least one signal to said microelectromechanical systems device. ### Claim 8 (depends on 7) The device of claim 7, further comprising a controller configured to send at least a portion of said image data to said driver circuit. ### Claim 9 (depends on 6) The device of claim 6, further comprising an image source module configured to send said image data to said processor. ### Claim 10 (depends on 9) The device of claim 9, wherein said image source module comprises at least one of a receiver, transceiver, and transmitter. ### Claim 11 (depends on 6) The device of claim 6, further comprising an input device configured to receive input data and to communicate said input data to said processor. ### Claim 12 A microelectromechanical systems (MEMS) based device, comprising: means for supporting a MEMS device, having the MEMS device formed thereon; first means for sealing comprising at least one orifice; and second means for sealing joined to said first sealing means, and comprising at least one desiccant area, wherein said at least one desiccant area is exposed to said MEMS device through said at, least one orifice. ### Claim 13 (depends on 12) The device of claim 12, wherein the supporting means comprises a transparent substrate. ### Claim 14 (depends on 12) The device of claim 12, wherein the first sealing means comprises a first backplate. ### Claim 15 (depends on 12) The device of claim 12, wherein the second sealing means comprises a second backplate. ### Claim 16 (depends on 12) The device of claim 12, wherein said supporting means comprises glass. ### Claim 17 (depends on 12) The device of claim 12, wherein said first sealing means comprises glass. ### Claim 18 (depends on 12) The device of claim 12, wherein the second sealing means comprises glass. ### Claim 19 (depends on 12) The device of claim 12, wherein the MEMS device comprises an interferometric modulator. ### Claim 20 (depends on 12) The device of claim 12, further comprising: a processor that is in electrical communication with said microelectromechanical systems device, said processor being configured to process image data; and a memory device in electrical communication with said processor. ### Claim 21 (depends on 20) The device of claim 20, further comprising a driver circuit configured to send at least one signal to said microelectromechanical systems device. ### Claim 22 (depends on 21) The device of claim 21, further comprising a controller configured to send at least a portion of said image data to said driver circuit. ### Claim 23 (depends on 20) The device of claim 20, further comprising an image source module configured to send said image data to said processor. ### Claim 24 (depends on 23) The device of claim 23, wherein said image source module comprises at least one of a receiver, transceiver, and transmitter. ### Claim 25 (depends on 20) The device of claim 20, further comprising an input device configured to receive input data and to communicate said input data to said processor.