# US 7,746,062 B2 · Radio frequency testing system and testing circuit utilized thereby > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,746,062 B2 - Document ID: US7746062B2 - Status: Granted - Kind: B2 - Application number: 12/185,110 - Filed: 2008-08-03 - Published: 2009-09-10 - Granted: 2010-06-29 - Earliest claimed: 2008-03-07 - Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.; Hon Hai Precision Industry Co., Ltd. - Inventors: Cheng-Yu Wu; Tao Yan - Web page: https://patentgrep.com/patent/US7746062B2 ## CPC - H04B 17/16: Test equipment located at the transmitter - H04B: TRANSMISSION ## Abstract A radio frequency (RF) testing system (100) includes a RF signal source (10) generating RF signals, an antenna (50), a RF testing circuit (40) disposed on a printed circuit board (PCB) (41), a testing probe (20) for receiving the RF signal from the RF testing circuit, and a testing apparatus (30) for testing the RF signals from the testing probe. The RF testing circuit includes a first pad (42), a second pad (44), a transmission line (48), and at least one ground portion (49) parallel to the transmission line. A distance between a first region defined by the first pad and a second region defined by the second pad positioned between the first region and the antenna is equal to one-fourth of the wavelength. During testing, the testing probe is electrically connected to the first pad, and the second pad is electrically connected to ground of the PCB. ## Claims ### Claim 1 A radio frequency testing system comprising: a radio frequency signal source generating radio frequency (RF) signals; an antenna; a radio frequency testing circuit disposed on a printed circuit board (PCB), the radio frequency testing circuit comprising a first pad, a second pad, a transmission line, and at least one ground portion parallel to the transmission line, a distance between a first region defined by the first pad and a second region defined by the second pad equal to one-fourth of wavelength of the RF signal, the second region positioned between the first region and the antenna; a testing probe for receiving the RF signal from the radio frequency testing circuit, the testing probe electrically connected to the antenna via the radio frequency testing circuit; and a testing apparatus for testing the RF signals from the testing probe, the testing apparatus electrically connected to the radio frequency testing circuit via the testing probe; wherein, during testing, the testing probe is electrically connected to the first pad, and the second pad is electrically connected to ground of the PCB. ### Claim 2 (depends on 1) The radio frequency testing system as claimed in claim 1, wherein the first pad comprises a signal pad arranged on the transmission line. ### Claim 3 (depends on 2) The radio frequency testing system as claimed in claim 2, wherein the first pad further comprises at least one ground pad arranged on the at least one ground portion. ### Claim 4 (depends on 3) The radio frequency testing system as claimed in claim 3, wherein the second pad comprises a signal pad arranged on the transmission line, and at least one ground pad arranged on the at least one ground portion. ### Claim 5 (depends on 4) The radio frequency testing system as claimed in claim 4, wherein the first pad and the second pad are exposed copper of the transmission line and the ground portions, respectively. ### Claim 6 (depends on 4) The radio frequency testing system as claimed in claim 4, wherein the first pad and the second pad are disposed on and electrically connected to the transmission line and the at least one ground portion, respectively. ### Claim 7 (depends on 1) The radio frequency testing system as claimed in claim 1, wherein the radio frequency testing circuit further comprises a metal plate arranged on the second region of the second pad to electrically connect the second pad to the ground of the PCB. ### Claim 8 (depends on 7) The radio frequency testing system as claimed in claim 7, wherein an area of the metal plate slightly exceeds that of the second region of the second pad. ### Claim 9 A radio frequency testing circuit disposed on a printed circuit board for testing a power of a radio frequency element via a testing probe and a testing apparatus, the radio frequency testing circuit comprising: a first pad defining a first region; a second pad defining a second region, wherein a distance between the first region and the second region equals one-fourth of wavelength of a radio frequency (RF) signal, the second pad disposed between the first region and the radio frequency element; a transmission line; and at least one ground portion parallel to the transmission line; wherein, during testing, the testing probe is electrically connected to the first pad, and the second pad is electrically connected to ground of the PCB. ### Claim 10 (depends on 9) The radio frequency testing circuit as claimed in claim 9, wherein the first pad comprises a signal pad arranged on the transmission line. ### Claim 11 (depends on 10) The radio frequency testing circuit as claimed in claim 10, wherein the first pad further comprises at least one ground pad arranged on the at least one ground portion. ### Claim 12 (depends on 11) The radio frequency testing circuit as claimed in claim 11, wherein the second pad comprises a signal pad arranged on the transmission line, and at least one ground pad arranged on the at least one ground portion. ### Claim 13 (depends on 12) The radio frequency testing circuit as claimed in claim 12, wherein the first pad and the second pad are exposed copper of the transmission line and the ground portions, respectively. ### Claim 14 (depends on 12) The radio frequency testing circuit as claimed in claim 12, wherein the first pad and the second pad are disposed on and electrically connected to the transmission line and the at least one ground portion, respectively. ### Claim 15 (depends on 9) The radio frequency testing circuit as claimed in claim 9, further comprising a metal plate arranged on the second region of the second pad to electrically connect the second pad to the ground of the PCB. ### Claim 16 (depends on 15) The radio frequency testing circuit as claimed in claim 15, wherein an area of the metal plate slightly exceeds that of the second region of the second pad.