# US 7,745,952 B2 · Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

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- Number: US 7,745,952 B2
- Document ID: US7745952B2
- Status: Granted
- Kind: B2
- Application number: 11/357,115
- Filed: 2006-02-21
- Published: 2006-10-19
- Granted: 2010-06-29
- Earliest claimed: 2005-03-31
- Assignees: Hitachi Industrial Equipment Systems Co., Ltd.
- Inventors: Kinya Nakatsu; Satoshi Ibori; Hideki Miyazaki
- Web page: https://patentgrep.com/patent/US7745952B2

## CPC

- H10W 90/00: Package configurations
- B60L 50/13: using AC generators and AC motors
- B60L 50/16: with provision for separate direct mechanical propulsion
- B60L 58/20: having different nominal voltages
- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H05K 7/14329: {specially adapted for the configuration of power bus bars}
- H05K 7/20927: {Liquid coolant without phase change}
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/641: {Snap-on arrangements, e.g. clips}
- H10W 70/465: {Bumps or wires}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/30: Die-attach connectors
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/5473: {multiple bond wires connected to a common bond pad}
- H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- Y02T 10/70: Energy storage systems for electromobility, e.g. batteries
- Y02T 10/7072: Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B60L: PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES (arrangements or mounting of electrical propulsion units or of plural diverse prime-movers for mutual or common propulsion in vehicles B60K1/00, B60K6/20; arrangements or mounting of electrical gearing in vehicles B60K17/12, B60K17/14; preventing wheel slip by reducing power in rail vehicles B61C15/08; dynamo-electric machines H02K; control or regulation of electric motors H02P); SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES (electric coupling devices combined with mechanical couplings of vehicles B60D1/64; electric heating for vehicles B60H1/00); ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL (control or regulation of electric motors H02P); MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02T: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION

## Abstract

A power module constructs a pressurizing tool by laminating an elastic member as well as a DC positive-side wiring member and DC negative-side wiring member in which currents flow in opposite directions. The pressurizing tool presses a first fixing tool, and then the first fixing tool presses semiconductor equipment. The semiconductor equipment is fixed to a heat dissipating member with its heat dissipating surface brought into surface contact with side wall surfaces of the heat dissipating member. The power module can enhance heat dissipation between a heat dissipating member and semiconductor equipment, and enables the semiconductor equipment to be fixed to the heat dissipating member without adding other components to the power module.

## Claims

### Claim 1

An electric circuit module, comprising:
a plurality of semiconductor components;
a heat dissipating member comprising a main body portion and configured to cool the plurality of the semiconductor components which are disposed along inner side walls formed in a long and slender recess located centrally of the main body portion;
a U-shaped fixing tool comprised of pressing parts and a connection part between the pressing parts that are arranged between the semiconductor components so that the pressing parts are elastically urged toward each other to push the semiconductor components against the respective inner side wall upon the fixing tool being installed along a longitudinal direction of said recess;
a DC positive-side wiring member and a DC negative-side wiring member so arranged so as to stand along opposite inner side walls of said first fixing tool; and
a fixing component so inserted between said DC positive-side wiring member and said DC negative-side wiring member to elastically fill a space between said both wiring members; wherein
a group of the semiconductor components is arranged on one side in said recess of said heat dissipating member is electrically connected to said DC positive-side wiring member, and another group of the semiconductor components is arranged on another side in said recess of said heat dissipating member are electrically connected to said DC negative-side wiring member.

### Claim 2 (depends on 1)

The electric circuit module according to claim 1, wherein said fixing component has elastic power and pushes said both wiring members against both the inner side wall of said first fixing tool, respectively.

### Claim 3 (depends on 1)

The electric circuit module according to claim 1, further comprising a second fixing tool which covers the open part of said recess of said heat dissipating member.