# US 7,745,945 B2 · Semiconductor package with position member > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,745,945 B2 - Document ID: US7745945B2 - Status: Granted - Kind: B2 - Application number: 11/545,814 - Filed: 2006-10-10 - Published: 2007-04-19 - Granted: 2010-06-29 - Earliest claimed: 2005-10-14 - Assignees: STMicroelectronics Asia Pacific Pte Ltd - Inventors: Kum-weng Loo; Chek-lim Kho; Jing-en Luan - Web page: https://patentgrep.com/patent/US7745945B2 ## CPC - H10W 74/016: {using moulds} - H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) - H10W 72/073: {of die-attach connectors} - H10W 72/07352: {changes in structures or sizes} - H10W 72/075: {of bond wires} - H10W 72/321: {Structures or relative sizes of die-attach connectors} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package. ## Claims ### Claim 1 A semiconductor package, comprising: a leadframe with a plurality of lead terminals and a die-attach pad; a die disposed onto the die-attach pad; a plurality of bonding wires electrically connecting the die and the plurality of lead terminals; a position member adhered directly to a surface of the die-attach pad opposite the die, wherein the position member is smaller then the die pad and configured to reduce vertical flexing of the die during a package assembly process; and a molding compound for encapsulating the leadframe, the die, the bonding wires, and at least a portion of each of the at-least one position member so as to form the semiconductor package, wherein a surface of the position member forms a portion of an exterior surface of the semiconductor package. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the position member is adhered to the surface of the die-attach pad by an adhesive. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the position member is made of at least one material selected from the group consisting of: Si, Cu, and Epoxy. ### Claim 4 (depends on 2) The semiconductor package of claim 2, wherein the position member comprises a thermally conductive material and the adhesive is a thermally conductive adhesive material. ### Claim 5 (depends on 1) The semiconductor package of claim 1, wherein the wire bonding is made of at least one material selected from the group consisting of: gold, copper, and aluminum. ### Claim 6 (depends on 1) The semiconductor package of claim 1, wherein the position member is an integral part of the leadframe. ### Claim 7 (depends on 2) The semiconductor package of claim 2, wherein the adhesive is selected from a group consisting of: glue, paste, tape and deformable material. ### Claim 8 (depends on 1) The semiconductor package of claim 1, wherein the die-attach pad is a split die-attach pad having first and second parts. ### Claim 9 (depends on 8) The semiconductor package of claim 8, wherein the position member is a first position member adhered to the first part of the split die-attach pad, and wherein a second position member is adhered to the second part of the split die-attach pad. ### Claim 10 (depends on 1) The semiconductor package of claim 1, wherein the die-attach pad is offset from a plane that includes lead terminals. ### Claim 11 (depends on 1) The semiconductor package of claim 1, wherein the exposed surface of the position member is co-planar with the exterior surface of the semiconductor package. ### Claim 12 A semiconductor package, comprising: a leadframe with a plurality of lead terminals and a die-attach pad; a die disposed onto the die-attach pad; a plurality of bonding wires electrically connecting the die and the plurality of lead terminals; a first position member disposed adjacent to a surface of the die-attach pad opposite the die; a second position member disposed adjacent to a surface of the die opposite the die-attach pad, wherein the first and second position members are smaller then the die pad and configured to reduce vertical flexing of the die during a package assembly process; and a molding compound for encapsulating the leadframe, the die, the bonding wires, and at least a portion of each of the first and second position members so as to form the semiconductor package, wherein a surface of each of the first and second position members forms a portion of an exterior surface of the semiconductor package. ### Claim 13 (depends on 12) The semiconductor package of claim 12, wherein the first position member is adhered to the surface of the die-attach pad and the second position member is adhered to the surface of the die by an adhesive. ### Claim 14 (depends on 12) The semiconductor package of claim 12, wherein at least one of the first and second position members is made of at least one material selected from the group consisting of: Si, Cu, and Epoxy. ### Claim 15 (depends on 13) The semiconductor package of claim 13, wherein at least one of the first and second position members comprises a thermally conductive material and the adhesive is a thermally conductive adhesive material. ### Claim 16 (depends on 12) The semiconductor package of claim 12, wherein the wire bonding is made of at least one material selected from the group consisting of gold, copper, and aluminum. ### Claim 17 (depends on 12) The semiconductor package of claim 12, wherein at least one of the first and second position members is an integral part of the leadframe. ### Claim 18 (depends on 13) The semiconductor package of claim 13, wherein the adhesive is selected from a group consisting of glue, paste, tape and deformable material. ### Claim 19 (depends on 12) The semiconductor package of claim 12, wherein the die-attach pad is a split die-attach pad having first and second parts. ### Claim 20 (depends on 19) The semiconductor package of claim 19, wherein the first position member is adhered to the first part of the split die-attach pad and a third position member is adhered to the second part of the split die-attach pad. ### Claim 21 (depends on 12) The semiconductor package of claim 12 wherein the die-attach pad is offset from a plane that includes lead terminals. ### Claim 22 (depends on 12) The semiconductor package of claim 12, wherein the exposed surface of the first position member is co-planar with a first exterior surface of the semiconductor package and the exposed surface of the second position member is co-planar with a second exterior surface of the semiconductor package. ### Claim 23 A semiconductor package, comprising: a leadframe with a plurality of lead terminals and a die-attach pad; a die disposed onto the die-attach pad; a plurality of bonding wires electrically connecting the die and the plurality of lead terminals; a position member disposed adjacent to a surface of the die opposite the die-attach pad, wherein the position member smaller then the die pad and configured to reduce vertical flexing of the die during a package assembly process; and a molding compound for encapsulating the leadframe, the die, the bonding wires, and at least a portion of the position member so as to form the semiconductor package, wherein a surface of the position member forms a portion of an exterior surface of the semiconductor package. ### Claim 24 (depends on 23) The semiconductor package of claim 23, wherein the position member is adhered to the surface of the die by an adhesive. ### Claim 25 (depends on 23) The semiconductor package of claim 23, wherein the position member is made of at least one material selected from the group consisting of: Si, Cu, and Epoxy. ### Claim 26 (depends on 24) The semiconductor package of claim 24, wherein the position member comprises a thermally conductive material and the adhesive is a thermally conductive adhesive material. ### Claim 27 (depends on 23) The semiconductor package of claim 23, wherein the wire bonding is made of at least one material selected from the group consisting of: gold, copper, and aluminum. ### Claim 28 (depends on 23) The semiconductor package of claim 23, wherein the position member is an integral part of the leadframe. ### Claim 29 (depends on 24) The semiconductor package of claim 24, wherein the adhesive is selected from a group consisting of: glue, paste, tape and deformable material. ### Claim 30 (depends on 23) The semiconductor package of claim 23, wherein the die-attach pad is offset from a plane that includes lead terminals. ### Claim 31 (depends on 23) The semiconductor package of claim 23, wherein the exposed surface of the position member is co-planar with the exterior surface of the semiconductor package.