# US 7,745,918 B1 · Package in package (PiP)

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- Number: US 7,745,918 B1
- Document ID: US7745918B1
- Status: Granted
- Kind: B1
- Application number: 11/168,168
- Filed: 2005-06-27
- Granted: 2010-06-29
- Earliest claimed: 2004-11-24
- Assignees: Amkor Technology, Inc.
- Inventors: Jon T. Woodyard
- Web page: https://patentgrep.com/patent/US7745918B1

## CPC

- H10W 90/00: Package configurations
- H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/865: {Die-attach connectors and bond wires}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/90: Bond pads, in general
- H10W 72/923: {Bond pads having multiple stacked layers}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A package includes an internal package stacked upon a primary die. The package includes interconnection balls to allow the package to be electrically and physically connected to a mother board. The package is mounted to the mother board in a single operation thus minimizing labor and the associated manufacturing cost. Further, the package is tested and verified to be non-defective prior to mounting to the mother board.

## Claims

### Claim 1

A structure comprising:
a primary substrate comprising a first surface and a second surface;
a primary die attached to the first surface;
primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces on the first surface of the primary substrate;
an internal package comprising:
an internal substrate comprising a first surface and a second surface;
an internal die attached to the first surface of the internal substrate; and
an adhesive attaching the internal package to the frontside surface of the primary die, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package entirely fits inward of the bond pads.

### Claim 2 (depends on 1)

The structure of claim 1 further comprising:
second traces on the second surface of the primary substrate, the second traces electrically connected to the first traces.

### Claim 3 (depends on 2)

The structure of claim 2 further comprising interconnection balls on the second traces.

### Claim 4 (depends on 1)

The structure of claim 1 wherein the internal package further comprises:
internal bond wires electrically connecting bond pads on a frontside surface of the internal die to first traces on the first surface of the internal substrate.

### Claim 5 (depends on 4)

The structure of claim 4 wherein the internal package further comprises an internal encapsulant encapsulating the first surface of the internal substrate, the internal die, and the internal bond wires.

### Claim 6 (depends on 5)

The structure of claim 5 wherein a first surface of the internal encapsulant is connected to the adhesive.

### Claim 7 (depends on 4)

The structure of claim 4 wherein the internal package further comprises second traces electrically coupled to the first traces of the internal package.

### Claim 8 (depends on 7)

The structure of claim 7 wherein the second traces of the internal package are electrically connected to the first traces of the primary substrate by secondary bond wires.

### Claim 9 (depends on 8)

The structure of claim 8 wherein the first surface of the primary substrate, the primary die, the primary bond wires, the adhesive, the internal package, and the secondary bond wires are encapsulated in a primary encapsulant.

### Claim 10 (depends on 1)

The structure of claim 1 further comprising a third die connected to the frontside surface of the primary die.

### Claim 11 (depends on 1)

The structure of claim 1 wherein the internal die is a first internal die, the internal package further comprising:
a second internal die mounted on the first internal die; and
a third internal die mounted on the second internal die.

### Claim 12 (depends on 1)

The structure of claim 1 wherein the
internal die is flip chip mounted to the internal substrate.

### Claim 13 (depends on 1)

The structure of claim 1 wherein the
internal substrate comprises a hole; and
the internal die is located within the hole.

### Claim 14 (depends on 1)

The structure of claim 1 wherein the primary substrate comprises a primary leadframe substrate.

### Claim 15

A structure comprising:
a primary substrate;
a primary die attached to the primary substrate;
primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces of the primary substrate;
an internal package comprising:
an internal substrate comprising a first surface and a second surface; and
an internal die attached to the first surface of the internal substrate,
wherein the internal package is mounted to the frontside surface of the primary die by an adhesive, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package does not extend beyond the bond pads on the frontside surface of the primary die; and
secondary bond wires electrically connecting the internal package to the primary substrate.

### Claim 16

A structure comprising:
a primary substrate comprising a first surface and a second surface;
a primary die attached to the first surface;
primary bond wires electrically connecting bond pads on a frontside surface of the primary die to first traces on the first surface of the primary substrate;
an internal package comprising:
an internal substrate comprising a first surface and a second surface;
an internal die attached to the first surface of the internal substrate;
internal bond wires electrically connecting bond pads on a frontside surface of the internal die to first traces on the first surface of the internal substrate; and
second traces electrically coupled to the first traces of the internal package;
an adhesive connected to the frontside surface of the primary die only inward of the bond pads of the primary die and the internal package, wherein the width of the internal package is less than the width between the bond pads on the frontside surface of the primary die such that the internal package entirely fits inward of the bond pads on the frontside surface of the primary die;
secondary bond wires electrically connecting the second traces of the internal package to the first traces of the primary substrate; and
second traces on the second surface of the primary substrate, the second traces electrically connected to the first traces of the primary substrate.

### Claim 17 (depends on 16)

The structure of claim 16 further comprising interconnection balls on the second traces of the primary substrate.

### Claim 18 (depends on 1)

The structure of claim 1 further comprising a passive device structure coupled to the first surface of the primary substrate.

### Claim 19 (depends on 18)

The structure of claim 18 wherein the passive device structure comprises terminals electrically connected to the first traces.