# US 7,745,916 B2 · Module comprising polymer-containing electrical connecting element > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,745,916 B2 - Document ID: US7745916B2 - Status: Granted - Kind: B2 - Application number: 11/638,847 - Filed: 2006-12-14 - Published: 2008-05-29 - Granted: 2010-06-29 - Earliest claimed: 2006-11-29 - Assignees: Infineon Technologies AG - Inventors: Horst Theuss - Web page: https://patentgrep.com/patent/US7745916B2 ## CPC - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - C09J 9/00: Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence) - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices - H10W 74/40: characterised by their materials - H10W 76/157: having interconnections parallel to the insulating or insulated base - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/07131: {Means for applying material, e.g. for deposition or forming coatings} - H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} - H10W 72/30: Die-attach connectors - H10W 72/655: {of outermost layers of multilayered strap connectors, e.g. material of a coating} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/00: Package configurations - Y10T 156/10: Methods of surface bonding and/or assembly therefor - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The invention relates to a module having a carrier element with electrical contact elements and a component applied to the carrier element with electrical connections on the side remote from the carrier element. The electrical connections of the component are electrically connected to contact elements of the carrier element via polymer-containing connecting elements. ## Claims ### Claim 1 A module comprising: a carrier element with electrical contact elements; a component applied to the carrier element with electrical connections on the side remote from the carrier element; and a polymer-containing connecting element that electrically connects one of the electrical connections of the component to one of the electrical contact elements of the carrier element. ### Claim 2 (depends on 1) The module according to claim 1, the component being fixed on the carrier element by means of a polymer-containing adhesive. ### Claim 3 (depends on 2) The module according to claim 2, the thickness of the adhesive being at least 100 micrometers. ### Claim 4 (depends on 2) The module according to claim 2, the adhesive comprising an electrical insulator. ### Claim 5 (depends on 2) The module according to claim 2, the adhesive being established on the basis of an epoxy resin or a silicone or a bismaleimide. ### Claim 6 (depends on 2) The module according to claim 2, the connecting element and the adhesive having similar coefficients of thermal expansion. ### Claim 7 (depends on 1) The module according to claim 1, the carrier element and the connecting element being at least partly encapsulated by a polymer-containing potting composition. ### Claim 8 (depends on 7) The module according to claim 7, the potting composition comprising an inner potting composition component and an outer potting composition component surrounding the inner potting composition component, the inner potting composition component being softer than the outer potting composition component. ### Claim 9 (depends on 7) The module according to claim 7, the potting composition or at least one component of the potting composition being transparent. ### Claim 10 (depends on 7) The module according to claim 7, the connecting element and the potting composition having similar coefficients of thermal expansion. ### Claim 11 (depends on 7) The module according to claim 7, further comprising the component being fixed on the carrier element by means of a polymer-containing adhesive, the adhesive and the potting composition having similar coefficients of thermal expansion. ### Claim 12 (depends on 11) The module according to claim 11, the connecting element and/or the adhesive and/or the potting composition having a coefficient of thermal expansion similar to that of silicon. ### Claim 13 (depends on 1) The module according to claim 1, the component comprising a semiconductor chip. ### Claim 14 (depends on 13) The module according to claim 13, the component comprising a pressure sensor. ### Claim 15 (depends on 1) The module according to claim 1, component being mounted in a depression provided on the carrier element. ### Claim 16 (depends on 1) The module according to claim 1, the component being in mechanical contact solely with polymer materials. ### Claim 17 (depends on 16) The module according to claim 16, the polymer materials that mechanically make contact with the component encompassing the connecting element, an adhesive and/or a potting composition. ### Claim 18 (depends on 1) The module according to claim 1, the component being completely encapsulated by polymer materials. ### Claim 19 (depends on 18) The module according to claim 18, the polymer materials that encapsulate the component encompassing the connecting element, an adhesive and/or a potting composition. ### Claim 20 (depends on 1) The module according to claim 1, the connecting element comprising a polymer filled with conductive particles, in particular silver particles. ### Claim 21 (depends on 1) The module according to claim 1, the connecting element comprising an intrinsically conductive polymer. ### Claim 22 (depends on 1) The module according to claim 1, the electrical contact elements of the carrier element being formed in the form of a leadframe. ### Claim 23 A module comprising: a carrier element with electrical contact elements; a component applied to the carrier element with electrical connections; and a polymer-containing, electrically conductive connecting element between one of the electrical connections of the component and one of the contact elements of the carrier element, the connecting element extending over a lateral area of the component. ### Claim 24 (depends on 23) The module according to claim 23, the connecting element bearing on the lateral area of the component.