# US 7,745,898 B2 · Multichip package, methods of manufacture thereof and articles comprising the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,745,898 B2 - Document ID: US7745898B2 - Status: Granted - Kind: B2 - Application number: 11/960,903 - Filed: 2007-12-20 - Published: 2009-06-25 - Granted: 2010-06-29 - Earliest claimed: 2007-12-20 - Assignees: International Business Machines Corporation - Inventors: Levi A. Campbell; Casimer M. DeCusatis - Web page: https://patentgrep.com/patent/US7745898B2 ## CPC - G02B 6/4201: {Packages, e.g. shape, construction, internal or external details} - G02B 6/4268: {Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47)} - G02B 6/4249: {comprising arrays of active devices and fibres} - H01S 5/02208: characterised by the shape of the housings - H01S 5/02251: using optical fibres - H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches - H01S 5/02407: {Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling} - H01S 5/423: {having a vertical cavity} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract Disclosed herein is a multichip package comprising an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the optoelectronics assembly; a plate having a first surface and a second surface; the first surface being opposedly disposed to the second surface; a portion of the first surface contacting a portion of the socket to provide thermal contact between the socket and the plate; a serpentine channel being disposed between the plate and the socket to provide a passage for a communication cable that is in operative communication with the optoelectronics assembly; and a heat exchanger in thermal contact with the plate; the heat exchanger being operative to cool the multichip package. ## Claims ### Claim 1 A multichip package comprising: an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the optoelectronics assembly; a plate having a first surface and a second surface; the first surface being opposedly disposed to the second surface; a portion of the first surface contacting a portion of the socket to provide thermal contact between the socket and the plate; a serpentine channel being disposed between the plate and the socket to provide a passage for a communication cable that is in operative communication with the optoelectronics assembly; and a heat exchanger in thermal contact with the plate; the heat exchanger being operative to cool the multichip package. ### Claim 2 (depends on 1) The multichip package of claim 1, wherein the optoelectronics assembly is disposed proximate to a vertical wall of the socket. ### Claim 3 (depends on 1) The multichip package of claim 1, wherein the socket further comprises an insert; the insert being disposed proximate to a location where the communication cable exits the multichip package. ### Claim 4 (depends on 3) The multichip package of claim 3, wherein the serpentine channel is disposed between the plate and the socket to provide a passage for a communication cable that is in operative communication with the optoelectronics assembly. ### Claim 5 (depends on 1) The multichip package of claim 1, wherein the serpentine channel comprises at least one elbow; the elbow having a first linear section and a second linear section; the first linear section and the second linear section being in communication with one another via a radial section. ### Claim 6 (depends on 1) The multichip package of claim 1, wherein the serpentine channel comprises a plurality of elbows; at least one elbow having two linear sections separated by a radial section; the linear sections being in communication with the radial section. ### Claim 7 (depends on 1) The multichip package of claim 1, wherein the serpentine channel comprises a plurality of elbows; each elbow having two linear sections separated by a radial section; the linear sections being in communication with the radial section. ### Claim 8 (depends on 1) The multichip package of claim 1, wherein the serpentine channel is operative to control the external forces that are transmitted to the optoelectronics assembly. ### Claim 9 (depends on 1) The multichip package of claim 1, wherein the serpentine channel comprises a seal that is effective to control the ingress of contaminants into the multichip package. ### Claim 10 (depends on 1) The multichip package of claim 1, wherein a wall of the serpentine channel is coated with a sealant that contacts the communication cable. ### Claim 11 (depends on 1) The multichip package of claim 1, wherein the portion of the first surface contacts the portion of the socket via a vertical wall. ### Claim 12 (depends on 1) The multichip package of claim 1, wherein the heat exchanger is a liquid cooled heat exchanger. ### Claim 13 (depends on 12) The multichip package of claim 12, wherein the optoelectronics assembly comprises a vertical cavity surface emitting laser. ### Claim 14 (depends on 1) The multichip package of claim 1, wherein the multichip package further comprises an optoelectronic transceiver, a fiber output, microprocessor, or a memory chip. ### Claim 15 (depends on 12) The multichip package of claim 12, wherein the optoelectronics assembly comprises a data processing chip, a data switching chip, a data storage chip, an electronic chip set that is configured for providing multiplexing, demultiplexing, coding or decoding, an optoelectronic element comprising laser diodes or photodetectors for driving and/or receiving functions, or a combination comprising at least one of the foregoing chips, chip sets or optoelectronic elements. ### Claim 16 A method comprising: disposing an optoelectronics assembly in a socket; the socket comprising a base plate, a wall, and an insert; disposing a plate on the socket; the disposing being effective to create a channel between the plate and the insert; disposing a communication cable in the channel; the communication cable contacting the optoelectronics assembly; and disposing a heat exchanger on a surface of the plate; the surface of the plate that contacts the heat exchanger being opposed to the surface that faces the optoelectronic assembly. ### Claim 17 (depends on 16) The method of claim 16, wherein the optoelectronics assembly is disposed at locations proximate to the vertical wall of the socket. ### Claim 18 (depends on 16) An article manufactured by the method of claim 16.