# US 7,745,897 B2 · Methods for packaging an image sensor and a packaged image sensor

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- Number: US 7,745,897 B2
- Document ID: US7745897B2
- Status: Granted
- Kind: B2
- Application number: 11/140,157
- Filed: 2005-05-27
- Published: 2006-11-30
- Granted: 2010-06-29
- Earliest claimed: 2005-05-27
- Assignees: Aptina Imaging Corporation
- Inventors: Cheng Why Tan; Piang Joon Seow
- Web page: https://patentgrep.com/patent/US7745897B2

## CPC

- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H10F 39/011: {Manufacture or treatment of image sensors covered by group H10F39/12}
- H10F 39/804: {Containers or encapsulations}
- H10W 72/0198: {batch processes}
- H10W 72/01515: {Forming coatings}
- H10W 72/01551: {Changing the shapes of bond wires}
- H10W 72/075: {of bond wires}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/5434: {the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.

## Claims

### Claim 1

A packaged image sensor comprising:
a substrate;
an image sensor attached to the substrate, wherein the image sensor has an active area;
electrical connections between the image sensor and the substrate;
a transparent cover large enough to cover the active area of the image sensor;
metallic bumps between the image sensor and the transparent cover in a pattern around the perimeter of the active area of the image sensor; and
adhesive between the image sensor and the transparent cover around the perimeter of the active area in a pattern that corresponds to the metallic bumps, wherein the adhesive connects the transparent cover and the image sensor such that the metallic bumps contact both the transparent cover and the image sensor.

### Claim 2 (depends on 1)

The packaged image sensor of claim 1 wherein the image sensor, the transparent cover, the metallic bumps, and the adhesive encapsulate the active area of the image sensor.

### Claim 3 (depends on 2)

The packaged image sensor of claim 2 further including epoxy formed over the electrical connections to encapsulate the electrical connections.

### Claim 4 (depends on 1)

The packaged image sensor of claim 1 wherein the metallic bumps are formed on the image sensor.

### Claim 5 (depends on 4)

The packaged images sensor of claim 4 wherein the metallic bumps are formed on bond pads of the image sensor.

### Claim 6 (depends on 4)

The packaged image sensor of claim 4, wherein the metallic bumps are formed on the image sensor separate from bond pads of the image sensor.

### Claim 7 (depends on 4)

The packaged image sensor of claim 4, wherein the transparent cover sits flush on top of the metallic bumps.

### Claim 8 (depends on 1)

The packaged image sensor of claim 1 wherein the metallic bumps are formed on the transparent cover.