# US 7,745,844 B2 · Light-emitting diode package and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,745,844 B2 - Document ID: US7745844B2 - Status: Granted - Kind: B2 - Application number: 11/910,174 - Filed: 2007-02-28 - Published: 2008-07-31 - Granted: 2010-06-29 - Earliest claimed: 2006-03-03 - Assignees: LG Innotek Co., Ltd. - Inventors: Kyung Ho Shin - Web page: https://patentgrep.com/patent/US7745844B2 ## CPC - H10H 20/8582: {characterised by their shape} - H10H 20/8506: {Containers} - H10H 20/856: Reflecting means - H10H 20/858: Means for heat extraction or cooling - H10H 20/8583: {not being in contact with the bodies} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer. ## Claims ### Claim 1 A light-emitting diode package, comprising: a metal plate including a first portion of an upper surface and a second portion of the upper surface beside the first portion of the upper surface of the metal plate; an insulating layer on the metal plate; circuit patterns on the insulating layer; and a light-emitting diode disposed on the first portion of the upper surface of the metal plate and electrically connected with the circuit patterns, wherein at least a portion of the second portion of the upper surface of the metal plate comprises grooves, and wherein the grooves of the second portion of the upper surface of the metal plate do not include light-emitting diodes therein. ### Claim 2 (depends on 1) The light-emitting diode package according to claim 1, further comprising a reflective layer formed directly on the insulating layer, wherein the reflective layer has a thickness different from the circuit patterns. ### Claim 3 (depends on 1) The light-emitting diode package according to claim 1, wherein at least a portion of a lower surface of the metal plate comprises grooves. ### Claim 4 (depends on 1) The light-emitting diode package according to claim 1, wherein the light-emitting diode is provided on a portion of the circuit patterns or a portion of a reflective layer on the insulating layer. ### Claim 5 (depends on 3) The light-emitting diode package according to claim 3, wherein the grooves in the upper surface do not overlap the grooves in the lower surface. ### Claim 6 (depends on 1) The light-emitting diode package according to claim 1, wherein a portion of the metal plate is exposed in an upper direction, wherein the exposed portion of the metal plate is a bottom surface of the grooves. ### Claim 7 (depends on 2) The light-emitting diode package according to claim 2, wherein the reflective layer is formed by mixing a primary component of TiO2 and a resin with CaCO3, BaSO4, ZnO, or a combination thereof. ### Claim 8 (depends on 2) The light-emitting diode package according to claim 2, further comprising a molding portion for protecting at least a portion of the circuit patterns and the light emitting diode, wherein the molding portion is contacted with a lateral surface of the reflective layer. ### Claim 9 An apparatus, comprising: a metal plate having grooves on an upper surface thereof, wherein the upper surface of the metal plate includes a first portion and a second portion beside the first portion, and wherein the grooves are formed on at least a portion of the second portion of the upper surface of the metal plate; an insulating layer on the metal plate, the insulating layer comprising an opening portion corresponding to the grooves of the metal plate; a circuit pattern on the insulating layer; and an electronic device disposed on a portion of the upper surface of the metal plate and electrically connected with the circuit pattern on the insulating layer, wherein the bottoms of the grooves do not include circuit patterns. ### Claim 10 (depends on 9) The apparatus according to claim 9, wherein the metal plate further has grooves on a lower surface thereof. ### Claim 11 (depends on 9) The apparatus according to claim 9, wherein the insulating layer and the circuit patterns are formed on regions of the upper surface of the metal plate in which the grooves have not been formed. ### Claim 12 (depends on 10) The apparatus according to claim 10, wherein the grooves in the upper surface do not overlap the grooves in the lower surface. ### Claim 13 A method for manufacturing a light-emitting diode package, the method comprising: preparing a metal core printed circuit board comprising a metal plate, an insulating layer on the metal plate, and circuit patterns on the insulating layer, wherein the metal core printed circuit board includes a first portion and a second portion beside the first portion at an upper surface thereof; selectively removing at least a portion of the metal plate and the insulating layer to form grooves at the second portion of the metal core printed circuit board; mounting a light-emitting diode on the first portion of the metal core printed circuit hoard; and electrically connecting the light-emitting diode with the circuit patterns, wherein the grooves at the second portion of the metal core circuit board do not include light-emitting diodes therein. ### Claim 14 (depends on 13) The method according to claim 13, wherein the grooves are formed using a mechanical method or a chemical method. ### Claim 15 (depends on 13) The method according to claim 13, wherein the grooves are formed in an upper surface of the metal plate by selectively removing portions of the upper surface of the metal plate and the insulating layer formed on the upper surface of the metal plate. ### Claim 16 (depends on 13) The method according to claim 13, wherein the grooves are formed in a lower surface of the metal plate by selectively removing portions of the lower surface of the metal plate. ### Claim 17 (depends on 13) The method according to claim 13, wherein the grooves are formed in an upper surface of the metal plate and a lower surface of the metal plate by selectively removing portions of the upper surface of the metal plate and an insulating layer formed on the upper surface of the metal plate, and portions of the lower surface of the metal plate. ### Claim 18 (depends on 13) The method according to claim 13, further comprising forming a reflective layer on the metal core printed circuit board, wherein the reflective layer has a thickness different from the circuit patterns. ### Claim 19 (depends on 18) The method according to claim 18, wherein forming the reflective layer comprises using screen printing with a resin formed by mixing one of TiO2, CaCO3, BaSO4, ZnO, or a combination thereof.