# US 7,745,840 B2 · Solide-state light source

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- Number: US 7,745,840 B2
- Document ID: US7745840B2
- Status: Granted
- Kind: B2
- Application number: 12/192,336
- Filed: 2008-08-15
- Published: 2009-06-04
- Granted: 2010-06-29
- Earliest claimed: 2007-11-29
- Assignees: Foxsemicon Integrated Technology, Inc.
- Inventors: Chun-Wei Wang; Hung-Kuang Hsu; Wen-Jang Jiang
- Web page: https://patentgrep.com/patent/US7745840B2

## CPC

- H10H 20/856: Reflecting means
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/882: {Scattering means (H10H20/82 takes precedence)}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A solid-state light source includes a substrate, a solid-state light-emitting chip, a plurality of micro-members and a light-permeable encapsulation. The substrate has a substantially flat surface. The solid-state light-emitting chip is arranged on the substantially flat surface of the substrate and electrically connected to the substrate. The micro-members are arranged on the surface of the substrate and parallel with the solid-state light emitting chip. The light-permeable encapsulation is arranged on the surface of the substrate and covers the solid-state light-emitting chip and the micro-members.

## Claims

### Claim 1

A solid-state light source, comprising:
a substrate having a substantially flat surface;
a solid-state light-emitting chip arranged on the substantially flat surface of the substrate and electrically connected to the substrate;
a plurality of micro-members arranged on the substantially flat surface of the substrate; and
a light-permeable encapsulation arranged on the substantially flat surface of the substrate and covering the solid-state light-emitting chip and the micro-members.

### Claim 2 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the light-permeable encapsulation has a refractive index different from that of the micro-members.

### Claim 3 (depends on 2)

The solid-state light source as claimed in claim 2, wherein the refractive index of the light-permeable encapsulation is more than or equal to 1.4.

### Claim 4 (depends on 1)

The solid-state light source as claimed in claim 1, wherein a height of the micro-members relative to the substantially flat surface of the substrate is less than that of the solid-state light-emitting chip relative to the substantially flat surface.

### Claim 5 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the solid-state light-emitting chip is surrounded by the micro-members.

### Claim 6 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the micro-members are distributed regularly on the substantially flat surface of the substrate to form an array.

### Claim 7 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the micro-members are distributed irregularly on the substantially flat surface of the substrate.

### Claim 8 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the micro-members are dot micro-members.

### Claim 9 (depends on 8)

The solid-state light source as claimed in claim 8, wherein the micro-members are selected from a group consisting of hemispherical, partially hemispherical and pyramidal.

### Claim 10 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the micro-members are elongated micro-members.

### Claim 11 (depends on 10)

The solid-state light source as claimed in claim 10, wherein the micro-members are selected from a group consisting of lenticular lenses and micro prisms.

### Claim 12 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the micro-members are made of plastic.

### Claim 13 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the micro-members are made of one of white ink and transparent ink.

### Claim 14 (depends on 1)

The solid-state light source as claimed in claim 1, wherein the solid-state light-emitting chip includes an LED chip.

### Claim 15

A device comprising:
a circuit board having a circuit board surface;
a light-emitting chip electrically mounted on the circuit board surface;
a plurality of reflecting members arranged on the circuit board surface surrounding the light-emitting chip therein; and
a light-permeable encapsulation arranged on the circuit board surface of the substrate and entirely covering the light-emitting chip and the reflecting members.

### Claim 16 (depends on 15)

The device as claimed in claim 15, wherein the reflecting members are protrusions protruding from the circuit board surface.

### Claim 17 (depends on 15)

The device as claimed in claim 15, wherein a height of the protrusions relative to the circuit board surface is less than that of the light-emitting chip relative to the circuit board surface.