# US 7,745,835 B2 · Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode

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- Number: US 7,745,835 B2
- Document ID: US7745835B2
- Status: Granted
- Kind: B2
- Application number: 11/808,587
- Filed: 2007-06-12
- Published: 2007-10-25
- Granted: 2010-06-29
- Earliest claimed: 2003-02-28
- Assignees: Citizen Electronics Co., Ltd.
- Inventors: Nodoka Oishi; Koichi Fukasawa; Sadato Imai
- Web page: https://patentgrep.com/patent/US7745835B2

## CPC

- H10H 20/858: Means for heat extraction or cooling
- H10H 20/8506: {Containers}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8586: {comprising fluids, e.g. heat-pipes}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.

## Claims

### Claim 1

A light emitting diode comprising:
a base having an electric conducting property;
a wire plate made of insulating material, having at least one hole, and secured to an upper surface of the base;
at least one electric conductive pattern provided on the wire plate;
at least one light emitting diode element including an anode and a cathode, with one of the anode and cathode formed at an upper surface and the other of the anode and cathode formed at a lower surface, the lower surface secured to the upper surface of the base within the hole of the wire plate;
a wire which connects the upper surface of the light emitting diode element to the electric conductive pattern provided on the wire plate, and the lower surface of the light emitting diode element secured to and electrically connected to the base;
the base having at least one projection at the upper surface as a terminal portion.

### Claim 2 (depends on 1)

The light emitting diode according to claim 1, wherein thickness of the wire plate with the electric conductive pattern provided thereon and thickness of the projection as the terminal portion are substantially the same.

### Claim 3 (depends on 1)

The light emitting diode according to claim 1, wherein the wire plate has at least one notch to expose the projection of the base.

### Claim 4 (depends on 1)

A light emitting diode device comprising:
the light emitting diode according to claim 1; and
a circuit board including electric conductive patterns and a hole through which light emitted from the light emitting diode passes;
the light emitting diode being provided at a lower side of the circuit board at the hole of the circuit board, and the electric conductive pattern being provided on the wire plate and the projection as the terminal portion of the light emitting diode being disposed to be in contact with and electrically connected to the electric conductive patterns of the lower side of the circuit board.

### Claim 5 (depends on 1)

A light emitting diode device comprising:
at least two light emitting diodes according to claim 1; and
a circuit board including electric conductive patterns and at least two holes through which light emitted from the light emitting diodes pass;
the light emitting diodes being provided at a lower side of the circuit board at the holes of the circuit board, and the electric conductive pattern being provided on the wire plate and the projection of the base in each of the light emitting diodes being disposed to be in contact with and electrically connected to the electric conductive patterns of the lower side of the circuit board.