# US 7,745,730 B2 · Wiring component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,745,730 B2 - Document ID: US7745730B2 - Status: Granted - Kind: B2 - Application number: 11/752,836 - Filed: 2007-05-23 - Published: 2007-10-11 - Granted: 2010-06-29 - Earliest claimed: 2006-01-17 - Assignees: Beru F1 Systems Limited - Inventors: John Michael Bailey - Web page: https://patentgrep.com/patent/US7745730B2 ## CPC - H01B 7/0838: {Parallel wires, sandwiched between two insulating layers} - H01B 13/01254: {Flat-harness manufacturing} - H01R 13/5845: {the strain relief being achieved by molding parts around cable and connections} - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract A wiring component includes an array of multiple wires, at least one connector which engages the wires, and at least two layers of a hardened fiber and a filler compound that sandwiches the wires. The areas adjacent to the wires include a filler which immobilizes the wires relative to the layers. In one embodiment at least a portion of the connector is embedded in the filler. ## Claims ### Claim 1 A wiring component comprising: an array of multiple wires; at least one connector which engages said wires; at least two layers of a hardened compound of fiber and a filler sandwiching said wires; the areas adjacent to the wires also comprising one of said filler and an additional filler which immobilizes the wires relative to said layers; wherein at least a portion of said connector is embedded in one of said filler and said additional filler; whereby said connector is immobilized relative to said layers. ### Claim 2 (depends on 1) A wiring component according to claim 1, wherein one of said filler and said additional filler is a non-conductive compound. ### Claim 3 (depends on 1) A wiring component according to claim 1, wherein said at least two layers of compound are employed on either side of the multiple wires. ### Claim 4 (depends on 1) A wiring component according to claim 1, wherein the wires each comprise a sheath in addition to said compound which is resistant to 100 degrees Celsius in a vacuum oven. ### Claim 5 (depends on 1) A wiring component according to claim 1, wherein the array is rigid and molded to conform to the shape of a vehicle component. ### Claim 6 (depends on 1) A wiring component according to claim 1, wherein the connector incorporates a cap protecting its connectable portion; wherein said cap incorporates a seal on the inside of said cap. ### Claim 7 (depends on 1) A wiring component according to claim 1, wherein the fibers are woven. ### Claim 8 (depends on 1) A wiring component according to claim 1, wherein the wires comprise copper and at least one sheath creating a bond between the wires and layers. ### Claim 9 (depends on 1) A wiring component according to claim 1, wherein the component incorporates a substantially planar portion and a lip extending from said planar portion, the lip running substantially along at least one edge of the length of the planar portion at an angle. ### Claim 10 A wiring component comprising: an array of multiple wires; at least two layers of a hardened compound incorporating a fiber and a resin, said hardened compound sandwiching said array; and a filler filling the areas adjacent to the wires; whereby at least one of said filler and said hardened compound immobilizes the wires relative to said layers; wherein the fibers are woven; and the wiring component is a rigid structure; wherein the component incorporates a substantially planar portion and a lip extending from said planar portion, the lip running substantially along at least one edge of the length of the planar portion at an angle. ### Claim 11 (depends on 10) A wiring component according to claim 10, wherein said filler is a non-conductive compound. ### Claim 12 (depends on 10) A wiring component according to claim 10, wherein said at least two layers of compound are employed on either side of the multiple wires. ### Claim 13 (depends on 10) A wiring component according to claim 10, wherein the wires each comprise a sheath in addition to said compound which is resistant to 100 degrees Celsius in a vacuum oven. ### Claim 14 (depends on 10) A wiring component according to claim 10, wherein the wires comprise copper and at least one sheath creating a bond between the wires and layers. ### Claim 15 A wiring component comprising: an array of multiple wires; at least two layers of a hardened compound incorporating a fiber and a resin, said hardened compound sandwiching said array; and a filler filling the areas adjacent to the wires; whereby at least one of said filler and said hardened compound immobilizes the wires relative to said layers; wherein the wires comprise copper and at least one sheath creating a bond between the wires and layers; wherein the wiring component is a rigid structure; wherein the component incorporates a substantially planar portion and a lip extending from said planar portion, the lip running substantially along at least one edge of the length of the planar portion at an angle. ### Claim 16 (depends on 15) A wiring component according to claim 15, wherein said filler is a non-conductive compound. ### Claim 17 (depends on 15) A wiring component according to claim 15, wherein at least two layers of compound are employed on either side of the multiple wires. ### Claim 18 A wiring component comprising: an array of multiple wires; at least two layers of a hardened compound incorporating a fiber and a resin; said hardened compound sandwiching said array; and a filler filling the areas adjacent to the wires; whereby at least one of said filler and said hardened compound immobilizes the wires relative to said layers; wherein the wires comprise copper and at least one sheath creating a bond between the wires and layers; wherein the wiring component is a rigid structure; wherein said at least one sheath is resistant to 100 degrees Celsius in a vacuum oven. ### Claim 19 (depends on 15) A wiring component according to claim 15, wherein the fibers are woven. ### Claim 20 A method of producing a wiring component, the method comprising the steps of: placing a plurality of wires between layers of a hardenable fiber and resin compound; vacuuming air from the array; placing the layers and wires on a mold; heat treating the array in a vacuum oven; and allowing the wiring component to cool into a rigid component. ### Claim 21 (depends on 20) A method according to claim 20, comprising the step of attaching a connector to said wires and clamping said connector to said mold to form a barrier between said compound and the connectable portion of said connector. ### Claim 22 A wiring component comprising: an array of multiple wires; at least one connector which engages said wires; at least two layers of a hardened fiber and a filler compound sandwiching said wires; the areas adjacent to the wires also comprising said filler compound which immobilizes the wires relative to said layers; wherein at least a portion of said connector is embedded in said filler compound and wherein the connector incorporates a cap protecting its connectable portion; wherein said cap incorporates a seal on the inside of said cap. ### Claim 23 (depends on 22) A wiring component according to claim 22, wherein said filler is a non-conductive compound. ### Claim 24 (depends on 22) A wiring component according to claim 22, wherein said at least two layers of compound are employed on either side of the multiple wires. ### Claim 25 (depends on 22) A wiring component according to claim 22, wherein the wires each comprise a sheath in addition to said compound which is resistant to 100 degrees Celsius in a vacuum oven. ### Claim 26 (depends on 22) A wiring component according to claim 22, wherein the array is rigid and moulded to conform to the shape of a vehicle component. ### Claim 27 (depends on 22) A wiring component according to claim 22, wherein the fibers are woven. ### Claim 28 (depends on 22) A wiring component according to claim 22, wherein the wires comprise copper and at least on sheath creating a bond between the wires and layers. ### Claim 29 (depends on 22) A wiring component according to claim 22, wherein the component incorporates a substantially planar portion and a lip running substantially along at least one edge of the length of the planar portion and extending from said planar portion at an angle.