# US 7,745,307 B2 · Method of manufacturing an inkjet head through the anodic bonding of silicon members

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 7,745,307 B2
- Document ID: US7745307B2
- Status: Granted
- Kind: B2
- Application number: 12/168,332
- Filed: 2008-07-07
- Published: 2008-11-27
- Granted: 2010-06-29
- Earliest claimed: 2004-12-24
- Assignees: Ricoh Printing Systems, Ltd.
- Inventors: Takao Umeda; Osamu Machida; Jun Nagata
- Web page: https://patentgrep.com/patent/US7745307B2

## CPC

- B41J 2/14274: {of stacked structure type, deformed by compression/extension and disposed on a diaphragm}
- B41J 2/1606: {Coating the nozzle area or the ink chamber}
- B41J 2/1612: {of stacked structure type, deformed by compression/extension and disposed on a diaphragm}
- B41J 2/1623: {bonding and adhesion}
- B41J 2/1632: {machining}
- B41J 2/1642: {thin film formation by CVD [chemical vapor deposition]}
- B41J 2/1643: {thin film formation by plating}
- B41J 2/1646: {thin film formation by sputtering}
- B41J 2002/14403: {including a filter}
- B41J 2202/20: Modules
- B41J 2202/21: Line printing
- Y10T 29/42: Piezoelectric device making
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

In a method of manufacturing an inkjet head, a silicon dioxide (SiO2) layer is produced on the surface of first silicon member formed from single-crystal silicon. Next, a glass layer formed of borosilicate glass or the like is sputtered onto the surface of the silicon dioxide (SiO2) layer. A silicon oxide (SiOx, x<2) layer is then formed on the surface of a second silicon member. The first and second silicon members and are bonded together by applying heat at about 450° C. with heaters, as a DC voltage is applied across electrode terminals. As a result, a silicon dioxide (SiO2) layer is formed at the interface of the glass layer and silicon oxide (SiOx, x<2) layer, anodically bonding the two layers.

## Claims

### Claim 1

A method of anodically bonding silicon members, the method comprising:
forming a silicon dioxide (SiO2) layer on a surface of a first silicon member;
forming a glass layer on a surface of the silicon dioxide (SiO2) layer;
forming a silicon oxide (SiOx, x<2) layer more deficient in oxygen than SiO2 on a surface of a second silicon member; and
bonding the first silicon member to the second silicon member by placing the surface of the glass layer in contact with the surface of the silicon oxide (SiOx, x<2) layer and applying heat to the first and second silicon members and a voltage across the first and second silicon members.

### Claim 2 (depends on 1)

A method of anodically bonding silicon members according to claim 1, wherein the step of forming the silicon oxide (SiOx, x<2) layer comprises:
forming a thermal oxide layer on the surface of the second silicon member; and
releasing oxygen atoms by irradiating the thermal oxide layer with UV rays or an electron beam.

### Claim 3 (depends on 1)

A method of anodically bonding silicon members according to claim 1, wherein the step of forming the silicon oxide (SiOx, x<2) layer is performed at lower oxidizing temperature and lower oxygen density than the oxidizing temperature and oxygen density when forming the thermal dioxide layer on the surface of the first silicon member.