# US 7,745,256 B2 · Rectangular-shaped controlled collapse chip connection

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- Number: US 7,745,256 B2
- Document ID: US7745256B2
- Status: Granted
- Kind: B2
- Application number: 12/114,867
- Filed: 2008-05-05
- Published: 2009-11-05
- Granted: 2010-06-29
- Earliest claimed: 2008-05-05
- Assignees: International Business Machines Corporation
- Inventors: Stephen P. Ayotte; David J. Hill; Timothy M. Sullivan
- Web page: https://patentgrep.com/patent/US7745256B2

## CPC

- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/251: {Materials}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A rectangular-shaped controlled collapse chip connection (C4) is described. In one embodiment, there is a semiconductor chip package that comprises a semiconductor chip package substrate and a semiconductor chip having a plurality of rectangular-shaped C4 contacts attached thereto that connect the semiconductor chip to the semiconductor chip package substrate. The plurality of rectangular-shaped C4 contacts are arranged along a surface of the semiconductor chip in an orientation that extends radially from a center of the surface of the semiconductor chip.

## Claims

### Claim 1

A computer-readable medium storing computer instructions, which when executed, enables a computer system to determine an arrangement of interconnects that connect a semiconductor chip to a semiconductor chip package substrate, the computer instructions comprising:
obtaining a plurality of rectangular-shaped controlled collapse chip connection (C4) contacts; and
determining an arrangement of the plurality of rectangular-shaped C4 contacts along a surface of the semiconductor chip, wherein the arrangement includes locating the plurality of rectangular-shaped C4 contacts along the surface of the semiconductor chip in an orientation that extends radially from a center of the surface of the semiconductor chip wherein the determining of the arrangement of the plurality of rectangular-shaped C4 contacts comprises instructions for determining a center point that the plurality of rectangular-shaped C4 contacts extend radially therefrom, wherein the center point has a position along the surface of the semiconductor chip described as:
r>r(1+^CTE(T−25° C.)), wherein
r is the absolute design location of the center point;
^CTE=CTEsubstrate- CTEchip, wherein CTEsubstrate is the CTE of the semiconductor chip package substrate and CTEchip is the CTE of the semiconductor chip; and
T is the temperature in Celsius in which the semiconductor chip package substrate is assembled with the semiconductor chip.

### Claim 2 (depends on 1)

The computer-readable medium according to claim 1, wherein the determining of the arrangement of the plurality of rectangular-shaped C4 contacts comprises instructions for ascertaining a material characteristic associated with the semiconductor chip package substrate and semiconductor chip and using the material characteristic to determine the arrangement of the plurality of the rectangular-shaped C4 contacts.

### Claim 3 (depends on 2)

The computer-readable medium according to claim 2, wherein the material characteristic associated with the semiconductor chip package substrate and semiconductor chip is a coefficient of thermal expansion (CTE).

### Claim 4 (depends on 1)

The computer-readable medium according to claim 1, further comprising instructions for determining locations to arrange the plurality of rectangular-shaped C4 contacts that extend radially from the location of the center point towards the edges of the surface of the semiconductor chip, wherein the locations are a function of a material characteristic associated with the semiconductor chip package substrate and semiconductor chip.

### Claim 5 (depends on 1)

The computer-readable medium according to claim 1, further comprising instructions for providing the plurality of rectangular-shaped C4 contacts with a maximum surface bonding area with the semiconductor chip package substrate.