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US 7,745,253 B2Granted
Ribbon bonding in an electronic package
AssigneeOrthodyne Electronics Corporation
InventorChristoph B. Luechinger
Life of this patent
Estimating the term…
Abstract
A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
Claims27
A method of electrically connecting an electronic device to an external lead, comprising:
- ultrasonically bonding, using a bond tool in connection with an ultrasonic bonding machine, a first portion of a conductive flexible ribbon to a first portion on a conductive upper surface of the device, the conductive flexible ribbon being a multi-layer ribbon including a lower aluminum layer positioned below an upper copper layer;
- feeding ribbon material to form a loop between (1) the first portion on the conductive upper surface and (2) the external lead;
- and
- bonding, using the bonding tool, a second portion of the conductive flexible ribbon to the external lead, wherein the entire ribbon is flexible.
1 more element
A method of electrically connecting an electronic device to an external lead, comprising:
- (1) ultrasonically bonding a first portion of a flexible conductive ribbon to a first portion on a conductive upper surface of the device;
- (2) bonding a second portion of the flexible conductive ribbon to the external lead, wherein the entire ribbon is flexible, such that between steps (1) and (2 ) a first ribbon loop has been bonded between the upper surface of the device and the external lead;
- and
- (3) bonding a second ribbon loop between the upper surface of the device and the external lead, the second ribbon loop being positioned above the first ribbon loop in a stacked configuration.
1 more element
Dependencies are inferred from the claim text.