# US 7,745,240 B2 · Manufacturing method of light-emitting element with surface layer removal

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- Number: US 7,745,240 B2
- Document ID: US7745240B2
- Status: Granted
- Kind: B2
- Application number: 11/826,085
- Filed: 2007-07-12
- Published: 2008-01-31
- Granted: 2010-06-29
- Earliest claimed: 2006-07-14
- Assignees: Eudyna Devices Inc.
- Inventors: Akira Furuya
- Web page: https://patentgrep.com/patent/US7745240B2

## CPC

- H10H 20/01: Manufacture or treatment
- H10H 20/819: characterised by their shape, e.g. curved or truncated substrates
- H10H 20/82: Roughened surfaces, e.g. at the interface between epitaxial layers
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A manufacturing method of a light-emitting element includes emitting a laser light to a division region for separating a light-emitting element formed on a substrate, physically dividing the substrate along the division region, and removing a surface layer on at least one of the side faces of the substrate that is exposed by the dividing of the substrate.

## Claims

### Claim 1

A manufacturing method of a light-emitting element comprising:
irradiating a laser light to a division region for separating light-emitting elements formed on a substrate;
physically dividing the substrate along the division region after the step of irradiating a laser light;
expanding an extensible sheet on which the light-emitting elements are adhered so that an interval between each of the light-emitting elements is more than half of a width of the light-emitting elements, after a step of physically dividing the substrate; and
removing an altered layer, that is formed during irradiating the laser light, on at least one of the side faces of the substrate that is exposed by the dividing of the substrate with a blast method, after a step of expanding the extensible sheet.

### Claim 2 (depends on 1)

The method as claimed in claim 1, wherein the substrate is a sapphire substrate.

### Claim 3 (depends on 1)

The method as claimed in claim 1, wherein the altered layer on all exposed side faces of the substrate are removed in the step of removing the altered layer.

### Claim 4 (depends on 1)

The method as claimed in claim 1, wherein the altered layer is removed with an etching method in the step of removing the altered layer.

### Claim 5 (depends on 1)

The method as claimed in claim 1 further comprising forming a protective layer on a face of the substrate to which the laser light is irradiated, before the step of dividing the substrate.